SLLS807A June   2007  – July 2024 TRS213

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Recommended Operating Conditions
    3. 5.3  Thermal Information
    4. 5.4  Electrical Characteristics
    5. 5.5  Electrical Characteristics, Driver
    6. 5.6  Switching Characteristics, Driver
    7. 5.7  ESD Protection, Driver
    8. 5.8  Electrical Characteristics, Receiver
    9. 5.9  Switching Characteristics, Receiver
    10. 5.10 ESD Protection, Receiver
  7. 6 Parameter Measurement Information
  8. 7 Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Typical Application
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ

5.3 Thermal Information

THERMAL METRIC(1)DW (SOIC)DB (SSOP)UNIT
28 PINS28 PINS
RθJAJunction-to-ambient thermal resistance72.366.1°C/W
RθJC(top)Junction-to-case (top) thermal resistance33.533.2°C/W
RθJBJunction-to-board thermal resistance37.137.0°C/W
ψJTJunction-to-top characterization parameter7.54.6°C/W
ψJBJunction-to-board characterization parameter37.136.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.