JAJSP98B August   2007  – October 2022 TRSF3243

PRODUCTION DATA  

  1. 1特長
  2. 2アプリケーション
  3. 3概要
  4. 4Revision History
  5. 5Pin Configuration and Functions
  6. 6Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information
    4. 6.4  Electrical Characteristics
    5. 6.5  Electrical Characteristics: Driver
    6. 6.6  Switching Characteristics: Driver
    7. 6.7  Electrical Characteristics: Receiver
    8. 6.8  Switching Characteristics: Receiver
    9. 6.9  Electrical Characteristics: Auto-Powerdown
    10. 6.10 Switching Characteristics: Auto-Powerdown
      1.      Parameter Measurement Information
  7. 7Detailed Description
    1. 7.1 Overview
    2. 7.2 Device Functional Modes
      1. 7.2.1 Function Tables
  8. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 サポート・リソース
    3. 8.3 商標
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  9. 9Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.3 Thermal Information

THERMAL METRIC(1) TSSOP (PW) SOIC (DW) DB (SSOP) UNIT
28 PINS 28 PINS 28 PINS
RθJA Junction-to-ambient thermal resistance 70.3 59.0 76.1 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.0 28.8 35.8 °C/W
RθJB Junction-to-board thermal resistance 29.2 30.3 37.4 °C/W
ψJT Junction-to-top characterization parameter 1.3 7.8 7.4 °C/W
ψJB Junction-to-board characterization parameter 28.8 30.0 37.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.