JAJSUV6C November   2008  – October 2024 TS3USB221A

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics
    6. 5.6  Dynamic Electrical Characteristics, VCC = 3.3V ±10%
    7. 5.7  Dynamic Electrical Characteristics, VCC = 2.5V ±10%
    8. 5.8  Switching Characteristics, VCC = 3.3V ±10%
    9. 5.9  Switching Characteristics, VCC = 2.5V ±10%
    10. 5.10 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Power Mode
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 ドキュメントの更新通知を受け取る方法
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

Changes from Revision A (February 2015) to Revision B (July 2024)

  • ドキュメント全体にわたって表、図、相互参照の採番方法を更新Go
  • 「特長」セクションの ESD 性能テスト条件を更新 Go
  • Changed CDM test conditions in the ESD Ratings table from: per JEDEC specification JESD22-C101 to: per ANSI/ESDA/JEDEC JS-002Go
  • Added footnote to the VI/O parameter in the Recommended Operating Conditions tableGo
  • Changed RSE (UQFN) junction-to-ambient thermal resistance value from: 179.7°C/W to: 204.8°C/WGo
  • Changed RSE (UQFN) junction-to-case (top) thermal resistance value from: 107.9°C/W to: 118.1°C/WGo
  • Changed RSE (UQFN) junction-to-board thermal resistance value from: 100.7°C/W to: 121.5°C/WGo
  • Changed RSE (UQFN) junction-to-top characterization parameter value from: 7.1°C/W to: 13.9°C/WGo
  • Changed RSE (UQFN) junction-to-board characterization parameter value from: 100.0°C/W to: 121.2°C/WGo
  • Changed the VIK value in the Electrical Characteristics table from: –1.8V maximum to: –1.8V minimumGo
  • Changed the Typical Characteristics sectionGo