SLLS783C May   2009  – March 2016 TSB81BA3E

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Description
  3. 3 Revision History
  4. 4 Description Continued
  5. 5 Pin Configuration and Function
  6. 6 Electrical Specfications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Thermal Information
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Electrical Characteristics, Driver
    5. 6.5 Electrical Characteristics, Receiver
    6. 6.6 Electrical Characteristics, Device
    7. 6.7 Switching Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 TTL Input Data
      2. 8.3.2 LVDS Output Data
    4. 8.4 Device Functional Modes
      1. 8.4.1 Input Clock Edge
      2. 8.4.2 Low Power Mode
      3. 8.4.3 1394b Port Interface Considerations
    5. 8.5 Programming
      1. 8.5.1 Power-Class
    6. 8.6 Register Maps
      1. 8.6.1 Internal Register Configuration
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Port Termination for a 1394 Bilingual Port
        2. 9.2.2.2 PHY-LINK Interface
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Board Stackup
      2. 11.1.2 Digital and Analog Partitioning
      3. 11.1.3 Image Planes
      4. 11.1.4 Parts Placement
      5. 11.1.5 Decoupling Capacitors
      6. 11.1.6 3W Rule for SCLK
  12. 12Device and Documentation Support
    1. 12.1 Device Support
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Designing With PowerPAD Devices (PFP Package Only)

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

12 Device and Documentation Support

12.1 Device Support

12.2 Related Links

The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy.

12.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.4 Trademarks

E2E, PowerPAD are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

12.5 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.