JAJSND0 September   2024 TUSB1021-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.2
      2. 7.3.2 4-Level Inputs
      3. 7.3.3 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 USB 3.2 2:1 MUX Description
      2. 7.4.2 Linear EQ Configuration
      3. 7.4.3 USB3.2 Modes
      4. 7.4.4 Operation Timing – Power Up
    5. 7.5 Programming
      1. 7.5.1 TUSB1021-Q1 I2C Target Behavior
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Register Maps
    1. 9.1 General Register (address = 0x0A) [reset = 00000001]
    2. 9.2 USB3.2 Control/Status Registers (address = 0x20) [reset = 00000000]
    3. 9.3 USB3.2 Control/Status Registers (address = 0x21) [reset = 00000000]
    4. 9.4 USB3.2 Control/Status Registers (address = 0x22) [reset = 00000000]
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.2.2.1 ESD Protection

It may be necessary to incorporate an ESD component to protect the TUSB1021-Q1 from electrostatic discharge (ESD). TI recommends following the ESD protection recommendations listed in Table 8-2. A clamp voltage greater than value specified in Table 8-2 may require a RESD on each differential pin. Place the ESD component near the USB connector.

Table 8-2 ESD Diodes Recommended Characteristics
PARAMETERRECOMMENDATION
Breakdown voltage≥ 3.5V
I/O line capacitanceData rates ≤ 5Gbps: ≤ 0.50pF
Data rates > 5Gbps: ≤ 0.35pF
Delta capacitance between any P and N I/O pins≤ 0.07pF
Clamping voltage at 8A IPP IO to GND (1)≤ 4.5V
Typical dynamic resistance≤ 30mΩ
(1) According to IEC 61000-4-5 (8/20μs current waveform)
Table 8-3 Recommended ESD Protection Component
MANUFACTURERPART NUMBERRESD TO SUPPORT IEC 61000-4-2 CONTACT ±8kV
NexperiaPUSB3FR41Ω
NexperiaPESD2V8Y1BSF1Ω
Texas InstrumentsTPD1E04U04DPLR2Ω
Texas InstrumentsTPD4E02B04DQAR2Ω