JAJSND0 September   2024 TUSB1021-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 USB 3.2
      2. 7.3.2 4-Level Inputs
      3. 7.3.3 Receiver Linear Equalization
    4. 7.4 Device Functional Modes
      1. 7.4.1 USB 3.2 2:1 MUX Description
      2. 7.4.2 Linear EQ Configuration
      3. 7.4.3 USB3.2 Modes
      4. 7.4.4 Operation Timing – Power Up
    5. 7.5 Programming
      1. 7.5.1 TUSB1021-Q1 I2C Target Behavior
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 ESD Protection
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Register Maps
    1. 9.1 General Register (address = 0x0A) [reset = 00000001]
    2. 9.2 USB3.2 Control/Status Registers (address = 0x20) [reset = 00000000]
    3. 9.3 USB3.2 Control/Status Registers (address = 0x21) [reset = 00000000]
    4. 9.4 USB3.2 Control/Status Registers (address = 0x22) [reset = 00000000]
  11. 10Device and Documentation Support
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 サポート・リソース
    3. 10.3 Trademarks
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

5.4 Thermal Information

THERMAL METRIC(1) Device UNIT
RGF (VQFN)
40 PINS
RθJA Junction-to-ambient thermal resistance 29.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 18.6 °C/W
RθJB Junction-to-board thermal resistance 10.8 °C/W
ΨJT Junction-to-top characterization parameter 0.3 °C/W
ΨJB Junction-to-board characterization parameter 10.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 3.5 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.