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  • TUSB212 USB 2.0高速信号コンディショナー

    • JAJSDO5A August   2017  – September 2017 TUSB212

      PRODUCTION DATA.  

  • CONTENTS
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  • TUSB212 USB 2.0高速信号コンディショナー
  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 EQ
      2. 7.3.2 DC BOOST
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low Speed (LS) Mode
      2. 7.4.2 Full Speed (FS) Mode
      3. 7.4.3 High Speed (HS) Mode
      4. 7.4.4 Shutdown Mode
      5. 7.4.5 I2C Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Test Procedure to Construct USB High Speed Eye Diagram
          1. 8.2.2.1.1 For a Host Side Application
          2. 8.2.2.1.2 For a Device Side Application
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報
  13. 重要なお知らせ

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • RWB|12
    • MPQF391C
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DATA SHEET

TUSB212 USB 2.0高速信号コンディショナー

このリソースの元の言語は英語です。 翻訳は概要を便宜的に提供するもので、自動化ツール (機械翻訳) を使用していることがあり、TI では翻訳の正確性および妥当性につきましては一切保証いたしません。 実際の設計などの前には、ti.com で必ず最新の英語版をご参照くださいますようお願いいたします。

1 特長

  • USB 2.0、OTG 2.0、BC 1.2と互換
  • ピン・ストラップまたはI2Cで構成可能
  • LS、FS、HS信号処理のサポート
  • USB切断およびシャットダウン時の非常に低い消費電力
  • 損失の大きなアプリケーション用に、デイジー・チェーン・デバイスにより信号ゲインを選択可能
  • D1P/MおよびD2P/Mを交換可能で、ホスト/デバイスに非依存
  • プリチャネルで最大5m、ポストチャネルで最大2mの長さのケーブルに対応
    • 外付けのプルダウン抵抗により、4つのAC昇圧設定を選択可能
    • DC昇圧とAC昇圧により最良の信号整合性を実現

2 アプリケーション

  • ノートブックPC
  • デスクトップPC
  • ドッキング・ステーション
  • タブレット
  • 携帯電話
  • アクティブ・ケーブル、ケーブル・エクステンダ
  • バックプレーン
  • TV

3 概要

TUSB212は、USBハイ・スピード(HS)信号コンディショナーで、伝送チャネルでのISI信号損失を補償するよう設計されています。

TUSB212は、特許出願中の設計により、USBロー・スピード(LS)およびフル・スピード(FS)信号でも関係なく動作します。LSおよびFS信号の特性は、TUSB212により影響を受けず、HS信号は補償されます。

信号のAC昇圧およびDC昇圧をプログラム可能であり、コネクタでハイ・スピード信号を最適化するようデバイスの性能を微調整できます。この機能は、USBハイ・スピード電気コンプライアンス・テストに合格するため役立ちます。

さらに、TUSB212はUSB On-The-Go (OTG)やBattery Charging (BC)プロトコルとも互換性があります。

製品情報 (1)

型番 パッケージ 本体サイズ(公称)
TUSB212
TUSB212I		 X2QFN (12) 1.60mm×1.60mm
  1. 利用可能なすべてのパッケージについては、このデータシートの末尾にある注文情報を参照してください。

概略回路図

TUSB212 sllsex5_simplified_schematics.gif

4 改訂履歴

Changes from * Revision (August 2017) to A Revision

  • Changed Note From: Pull-up resistors for SDA and SCL pins in I2C mode should be 2 kΩ (5%). To: Pull-up resistors for SDA and SCL pins in I2C mode should be 4.7 kΩ (5%) in the Pin Functions tableGo
  • Added Test Conditions to RSTN: VIH and VIL in the Electrical Characteristics tableGo
  • Added new parameters to SCL/SDA: VIH, VIL, VSDA_OL, ISDA_OL the Electrical Characteristics tableGo
  • Added Test Conditions To: DC_BOOST: VIH, VIM, and VIL the Electrical Characteristics tableGo
  • Added test conditions to trise_dxx and tfall_dxx in the Switching Characteristics tableGo

5 Pin Configuration and Functions

RWB Package
12 Pin (X2QFN)
Top View
TUSB212 RWB_po_SLLSEX5.gif

Pin Functions

PIN I/O INTERNAL
PULLUP/PULLDOWN		 DESCRIPTION
NAME NO.
D1M 1 I/O N/A USB High Speed negative port..
D1P 2 I/O N/A USB High Speed positive port.
SDA(1) 3 I/O RSTN asserted: 500 kΩ PD I2C Mode:
Bidirectional I2C data pin [I2C address = 0x2C].
In non I2C mode:
Reserved for TI test purpose.
SCL(1)/CD 4 I/O RSTN asserted: 500 kΩ PD In I2C mode:
I2C clock pin [I2C address = 0x2C].
Non I2C mode:
After reset: Output CD. Flag indicating that a USB device is attached (connection detected). Asserted from an unconnected state upon detection of DP or DM pull-up resistor. De-asserted upon detection of disconnect.
RSTN 5 I 500 kΩ PU Device disable/enable.
Low – Device is at reset and in shutdown, and
High – Normal operation.
Recommend 0.1-µF external capacitor to GND to ensure clean power on reset if not driven.
If the pin is driven, it must be held low until the supply voltage for the device reaches within specifications.
EQ 6 I N/A USB High Speed AC boost select via external pull down resistor.
Sampled upon de-assertion of RSTN. Does not recognize real time adjustments.
Auto selects max AC Boost when left floating.
D2P 7 I/O N/A USB High Speed positive port.
D2M 8 I/O N/A USB High Speed negative port.
DC_BOOST(2)/ENA_HS 9 I/O In I2C mode:
Reserved for TI test purpose.
In non-I2C mode:
At reset: 3-level input signal DC_BOOST. USB High Speed DC signal boost selection.
H (pin is pulled high) – 80 mV
M (pin is left floating) – 60 mV
L (pin is pulled low) – 40 mV
After reset: Output signal ENA_HS. Flag indicating that channel is in High Speed mode. Asserted upon:
1. Detection of USB-IF High Speed test fixture from an unconnected state followed by transmission of USB TEST_PACKET pattern.
2. Squelch detection following USB reset with a successful HS handshake [HS handshake is declared to be successful after single chirp J chirp K pair where each chirp is within 18 μs – 128 μs].
GND 10 P N/A Ground
VREG 11 O N/A 1.8-V LDO output. Only enabled when operating in High Speed mode. Requires 0.1-µF external capacitor to GND to stabilize the core.
VCC 12 P N/A Supply power
(1) Pull-up resistors for SDA and SCL pins in I2C mode should be 4.7 kΩ (5%). If both SDA and SCL are pulled up at reset the device enters into I2C mode.
(2) Pull-down and pull-up (to 3.3 V) resistors for DC_BOOST pins must be between 22 kΩ to 47 kΩ in non I2C mode.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature and voltage range (unless otherwise noted)(1)
MIN MAX UNIT
Supply Voltage Range VCC -0.3 3.8 V
Voltage Range on I/O pins DxP, DxM, RSTN, EQ, SCL, SDA, DC_BOOST, VREG -0.3 3.8 V
Tstg Storage temperature -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature and voltage range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Supply Voltage 3 3.3 3.6 V
TA Ambient temperature TUSB212 0 70 °C
TUSB212I -40 85 °C
TJ Junction temperature TUSB212 0 85 °C
TUSB212I -40 105 °C

6.4 Thermal Information

THERMAL METRIC(1) TUSB212 UNIT
RWB (VQFN)
12 PINS
RθJA Junction-to-ambient thermal resistance 137.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 62 °C/W
RθJB Junction-to-board thermal resistance 67.2 °C/W
ΨJT Junction-to-top characterization parameter 1.9 °C/W
ΨJB Junction-to-board characterization parameter 67.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.

6.5 Electrical Characteristics

over operating free-air temperature and voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
POWER
IACTIVE_HS High-speed (HS) active curent USB channel = HS mode; 480 Mbps traffic; VCC = 3.3V; VCC supply stable; DC Boost = 60 mV 22 30 mA
IIDLE_HS High-speed idle current USB channel = HS mode; no traffic; VCC = 3.3V; VCC supply stable; DC Boost = 60 mV 14 22 mA
ISUSPEND_HS High-speed suspend current USB channel = HS suspend mode; VCC = 3.3V; VCC supply stable 0.55 1.5 mA
IFS_LS Full/Low speed current USB channel = FS mode or LS mode; VCC = 3.3V 0.6 1.5 mA
IDISCONNECT Disconnect current Host side application; No device attachment; VCC = 3.3V 0.7 1.5 mA
IRSTN Disable current RSTN driven low; VCC supply stable; VCC = 3.3V 13 80 µA
ILKG_FS Pin fail-safe leakage current for SDA, SCL, DC_BOOST, DxP/N, RSTN VCC = 0 V; Pin at 3.6 V 40 µA
RSTN
VIH High-level input voltage VCC = 3.0V 2 3.6 V
VIL Low-level input voltage VCC = 3.6V 0 0.8 V
IIH High-level input current VIH = 3.6 V -4 4 µA
IIL Low-level input current VIL = 0 V -11 11 µA
EQ
REQ External pull-down resistor on EQ pin. AC Boost Level 0 160 Ω
AC Boost Level 1 1.4 2 kΩ
AC Boost Level 2 3.7 3.9 kΩ
AC Boost Level 3 6 kΩ
CD, ENA_HS
VOH High-level output voltage IO = -50µA 2.4 V
VOL Low-level output voltage IO = 50µA 0.4 V
SCL, SDA
CI2CBUS I2C Bus capacitance 4 150 pF
VIH SDA and SCL input high level voltage VCC = 3.0V 2 3.6 V
VIL SDA and SCL input low level voltage VCC = 3.6V 0.8 V
VSDA_OL SDA  low level output voltage 4.7kΩ pullup to 3.6V;  VCC = 3.0V 0.4 V
ISDA_OL SDA  low level output current VCC = 3.6V 1.1 mA
DC_BOOST
VIH High-level input voltage VCC = 3.3V 2.4 3.6 V
VIM Mid-level input voltage VCC = 3.3V 1.6 V
VIL Low-level input voltage VCC = 3.3V 0 0.4 V
DxP, DxM
CIO_DXX Capacitance to GND Measured with LCR meter and device powered down. 1 MHz sinusoid, 30 mVpp ripple 2.4 pF

6.6 Switching Characteristics

over operating free-air temperature and voltage range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
FBR_DXX DxP/M bit rate USB channel = HS mode; 480 Mbps traffic; VCC supply stable 480.24 Mbps
tRISE_DXX DxP/M rise time 10% - 90%; VCC = 3.6V; Max AC Gain; 100 ps
tFALL_DXX DxP/M fall time 90% - 10%; VCC = 3.6V; Max AC Gain; 100 ps
tRSTN_PULSE_WIDTH Minimum width to detect a valid RSTN signal assert when the pin is actively driven VCC = 3.0 V; Refer to Figure 1 20 µs
tSTABLE VCC stable before RSTN de-assertion  Refer to Figure 1 100 µs
tVCC_RAMP VCC ramp time 0.2 100 ms
TUSB212 timing-01-sllsex5.gif Figure 1. Power On and Reset Timing

6.7 Typical Characteristics

TUSB212 sllsex6_2mpost_without.gif Figure 2. USB2.0 HS Eye Diagram, Host far-end with 2m cable post-channel loss without TUSB212
TUSB212 tc_host_eye_5m_sllsex6.png Figure 4. USB2.0 HS Eye Diagram, Host far-end with 5m cable pre-channel loss without TUSB212
TUSB212 sllsex6_2mpost_with.gif Figure 3. USB 2.0 HS Eye Diagram, Host far-end with 2m cable post-channel loss with TUSB212
TUSB212 tc_tusb213_eye_5m_sllsex6.png Figure 5. USB2.0 HS Eye Diagram, Host far-end with 5m cable pre-channel loss with TUSB212

 
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