JAJSUV7C July   2015  – July 2024 TUSB4041I-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 3.3-V I/O Electrical Characteristics
    6. 5.6 Power-Up Timing Requirements
    7. 5.7 Hub Input Supply Current
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Battery Charging Features
      2. 6.3.2 USB Power Management
      3. 6.3.3 One-Time Programmable Configuration
      4. 6.3.4 Clock Generation
      5. 6.3.5 Crystal Requirements
      6. 6.3.6 Input Clock Requirements
      7. 6.3.7 Power-Up and Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 External Configuration Interface
      2. 6.4.2 I2C EEPROM Operation
      3. 6.4.3 SMBus Target Operation
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Upstream Port Implementation
        2. 7.2.2.2 Downstream Port 1 Implementation
        3. 7.2.2.3 Downstream Port 2 Implementation
        4. 7.2.2.4 Downstream Port 3 Implementation
        5. 7.2.2.5 Downstream Port 4 Implementation
        6. 7.2.2.6 VBUS Power Switch Implementation
        7. 7.2.2.7 Clock, Reset, and Miscellaneous
        8. 7.2.2.8 TUSB4041I-Q1 Power Implementation
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 TUSB4041I-Q1 Power Supply
      2. 7.3.2 Downstream Port Power
      3. 7.3.3 Ground
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Placement
        2. 7.4.1.2 Package Specific
        3. 7.4.1.3 Differential Pairs
      2. 7.4.2 Layout Example
  9. 8 Register Maps
    1. 8.1  Configuration Registers
    2. 8.2  ROM Signature Register
    3. 8.3  Vendor ID LSB Register
    4. 8.4  Vendor ID MSB Register
    5. 8.5  Product ID LSB Register
    6. 8.6  Product ID MSB Register
    7. 8.7  Device Configuration Register
    8. 8.8  Battery Charging Support Register
    9. 8.9  Device Removable Configuration Register
    10. 8.10 Port Used Configuration Register
    11. 8.11 Device Configuration Register 2
    12. 8.12 USB 2.0 Port Polarity Control Register
    13. 8.13 UUID Byte N Register
    14. 8.14 Language ID LSB Register
    15. 8.15 Language ID MSB Register
    16. 8.16 Serial Number String Length Register
    17. 8.17 Manufacturer String Length Register
    18. 8.18 Product String Length Register
    19. 8.19 Serial Number String Registers
    20. 8.20 Manufacturer String Registers
    21. 8.21 Product String Byte N Register
    22. 8.22 Additional Feature Configuration Register
    23. 8.23 Device Status and Command Register
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4.1.3 Differential Pairs

This section describes the layout recommendations for all the TUSB4041I-Q1 device differential pairs: USB_DP_XX, USB_DM_XX.

  • The differential pairs must be designed with a differential impedance of 90 Ω ± 10%.
  • To minimize crosstalk, TI recommends to keep high-speed signals away from each other. Separate each pair by at least 5 times the signal trace width. Separating with ground as depicted in the layout example also helps minimize crosstalk.
  • Route all differential pairs on the same layer adjacent to a solid ground plane.
  • Do not route differential pairs over any plane split.
  • Adding test points causes impedance discontinuity and therefore negatively impacts signal performance. If test points are used, place them in series and symmetrically. Do not place them in a manner that causes stub on the differential pair.
  • Avoid 90° turns in trace. Keep the use of bends in differential traces to a minimum. When bends are used, make sure the number of left and right bends are as equal as possible and that the angle of the bend is ≥135°. This guideline minimizes any length mismatch caused by the bends and therefore minimize the impact bends have on EMI.
  • Minimize the trace lengths of the differential pair traces. Eight inches is the maximum recommended trace length for USB 2.0 differential pair signals. Longer trace lengths require very careful routing to ensure proper signal integrity.
  • Match the etch lengths of the differential pair traces (that is DP and DM). Make sure the USB 2.0 differential pairs do not exceed 50 mils relative trace length difference.
  • Minimize the use of vias in the differential pair paths as much as possible. If this is not practical, make sure that the same via type and placement are used for both signals in a pair. Place any vias used as close as possible to the TUSB4041I-Q1 device.
  • To ease routing of the USB 2.0 DP and DM pair, the polarity of these pins can be swapped. If this is done, set the appropriate Px_usb2pol register, where x = 0, 1, 2, 3, or 4.
  • Do not place power fuses across the differential pair traces.