JAJSPY8E january   2007  – march 2023 TXB0101

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specification
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements, VCCA = 1.2 V
    7. 6.7  Timing Requirements, VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements, VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements, VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements, VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics, VCCA = 1.2 V
    12. 6.12 Switching Characteristics, VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics, VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics, VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics, VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
      1.      Parameter Measurement Information
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Architecture
      2. 7.3.2 Power Up
      3. 7.3.3 Enable and Disable
      4. 7.3.4 Pullup or Pulldown Resistors on I/O Lines
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
        1. 8.2.1.1 Input Driver Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  9. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 サポート・リソース
    3. 9.3 Trademarks
    4. 9.4 静電気放電に関する注意事項
    5. 9.5 用語集
  10. 10Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)TXB0101UNIT
DBV (SOT-23)DCK (SC70)DRL (SOT)YZP (DSBGA)
6 PINS6 PINS6 PINS6 PINS
RθJAJunction-to-ambient thermal resistance192.3266.9204.2105.8°C/W
RθJC(top)Junction-to-case (top) thermal resistance164.880.476.41.6°C/W
RθJBJunction-to-board thermal resistance38.699.138.710.8°C/W
ψJTJunction-to-top characterization parameter43.71.53.43.1°C/W
ψJBJunction-to-board characterization parameter38.198.338.510.8°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistanceN/AN/AN/AN/A°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.