JAJSGO2H November   2006  – August 2020 TXB0108

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     6
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements: VCCA = 1.2 V
    7. 6.7  Timing Requirements: VCCA = 1.5 V ± 0.1 V
    8. 6.8  Timing Requirements: VCCA = 1.8 V ± 0.15 V
    9. 6.9  Timing Requirements: VCCA = 2.5 V ± 0.2 V
    10. 6.10 Timing Requirements: VCCA = 3.3 V ± 0.3 V
    11. 6.11 Switching Characteristics: VCCA = 1.2 V
    12. 6.12 Switching Characteristics: VCCA = 1.5 V ± 0.1 V
    13. 6.13 Switching Characteristics: VCCA = 1.8 V ± 0.15 V
    14. 6.14 Switching Characteristics: VCCA = 2.5 V ± 0.2 V
    15. 6.15 Switching Characteristics: VCCA = 3.3 V ± 0.3 V
    16. 6.16 Operating Characteristics
    17. 6.17 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Architecture
      2. 8.3.2 Input Driver Requirements
      3. 8.3.3 Output Load Considerations
      4. 8.3.4 Enable and Disable
      5. 8.3.5 Pullup or Pulldown Resistors on I/O Lines
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 静電気放電に関する注意事項
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Package Addendum
      1. 13.1.1 Tape and Reel Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • ZXY|20
  • YZP|20
  • NME|20
  • DQS|20
  • PW|20
  • RGY|20
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1) TXB0108 UNIT
PW RGY DQS YZP GXY ZXY NME
20 PINS
RθJA Junction-to-ambient thermal resistance 101.8 35.3 108.5 66.2 156.7 156.7 131.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 35.5 42.1 32.3 0.4 39.9 39.9 56.5 °C/W
RθJB Junction-to-board thermal resistance 52.8 11.1 42.4 52.0 85.9 85.9 83.2 °C/W
ψJT Junction-to-top characterization parameter 2.2 0.7 0.7 1.5 1.1 1.1 1.5 °C/W
ψJB Junction-to-board characterization parameter 52.2 11.2 42 51.9 85.4 85.4 82.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – 3.8 – – – – – °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.