JAJSQ37 july   2023 TXV0106-Q1

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, VCCA = 1.8 ± 0.15 V
    7. 6.7 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    8. 6.8 Switching Characteristics, VCCA = 3.3 ± 0.3 V
  8. Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 Partial Power Down (Ioff)
      3. 8.3.3 VCC Isolation and VCC Disconnect (Ioff-float)
      4. 8.3.4 Over-Voltage Tolerant Inputs
      5. 8.3.5 Negative Clamping Diodes
      6. 8.3.6 Fully Configurable Dual-Rail Design
      7. 8.3.7 Supports High-Speed Translation
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Application Information

The TXV0106-Q1 device can be used in level-translation applications for interfacing devices or systems operating at different interface voltages with one another. The TXV0106-Q1 device is an excellent choice for use in applications where a push-pull driver is connected to the data I/Os. The maximum data rate can be up to 320Mbps when device translates a signal from 1.8 V to 3.3 V.