JAJSQ37 july   2023 TXV0106-Q1

ADVANCE INFORMATION  

  1.   1
  2. 特長
  3. アプリケーション
  4. 概要
  5. Revision History
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics, VCCA = 1.8 ± 0.15 V
    7. 6.7 Switching Characteristics, VCCA = 2.5 ± 0.2 V
    8. 6.8 Switching Characteristics, VCCA = 3.3 ± 0.3 V
  8. Parameter Measurement Information
    1. 7.1 Load Circuit and Voltage Waveforms
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Balanced High-Drive CMOS Push-Pull Outputs
      2. 8.3.2 Partial Power Down (Ioff)
      3. 8.3.3 VCC Isolation and VCC Disconnect (Ioff-float)
      4. 8.3.4 Over-Voltage Tolerant Inputs
      5. 8.3.5 Negative Clamping Diodes
      6. 8.3.6 Fully Configurable Dual-Rail Design
      7. 8.3.7 Supports High-Speed Translation
    4. 8.4 Device Functional Modes
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information
    2. 11.2 Mechanical Data

パッケージ・オプション

メカニカル・データ(パッケージ|ピン)
サーマルパッド・メカニカル・データ
発注情報

Layout Guidelines

For device reliability, follow common printed-circuit board layout guidelines such as the following:

  • Use short trace lengths to avoid excessive.
  • Use bypass capacitors on the power supply pins and place them as close to the device as possible.
  • A 0.1-µF bypass capacitor is recommended, but transient performance can be improved by having both 1-µF and 0.1-µF capacitors in parallel with the smallest value capacitor placed closest to the power pin.
  • The high drive capability of this device creates fast edges into light loads. Routing and load conditions should be considered to prevent ringing.