JAJSR37A August   2023  – September 2023 UCC14340-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Device Comparison
  7. 6 Pin Configuration and Functions
  8. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Insulation Specifications
    6. 7.6 Safety-Related Certifications
    7. 7.7 Electrical Characteristics
    8. 7.8 Safety Limiting Values
    9. 7.9 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 機能ブロック図
    3. 8.3 Feature Description
      1. 8.3.1 Power Stage Operation
        1. 8.3.1.1 VDD-VEE Voltage Regulation
        2. 8.3.1.2 COM-VEE Voltage Regulation
        3. 8.3.1.3 Power Handling Capability
      2. 8.3.2 Output Voltage Soft Start
      3. 8.3.3 ENA and PG
      4. 8.3.4 Protection Functions
        1. 8.3.4.1 Input Undervoltage Lockout
        2. 8.3.4.2 Input Overvoltage Lockout
        3. 8.3.4.3 Output Undervoltage Protection
        4. 8.3.4.4 Output Overvoltage Protection
        5. 8.3.4.5 Overpower Protection
        6. 8.3.4.6 Overtemperature Protection
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Capacitor Selection
        2. 9.2.2.2 Single RLIM Resistor Selection
        3. 9.2.2.3 RDR Circuit Component Selection
        4. 9.2.2.4 Feedback Resistors Selection
  11. 10System Examples
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  14. 13デバイスおよびドキュメントのサポート
    1. 13.1 ドキュメントのサポート
      1. 13.1.1 関連資料
    2. 13.2 ドキュメントの更新通知を受け取る方法
    3. 13.3 サポート・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 用語集
  15. 14Mechanical, Packaging, and Orderable Information
  16. 15Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) UNIT
DWN (SOIC)
36 PINS
RθJA Junction-to-ambient thermal resistance 52.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.5 °C/W
RθJB Junction-to-board thermal resistance 25.9 °C/W
ΨJA Junction-to-ambient characterization parameter 29.5 °C/W
ΨJT Junction-to-top characterization parameter 16.6 °C/W
ΨJB Junction-to-board characterization parameter 25.6 °C/W
(1) The thermal resistances (R) are based on JEDEC board, and the characterization parameters (Ψ) are based on the EVM described in the Layout section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.