JAJSPV4C February   2023  – March 2024 UCC14341-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Insulation Specifications
    6. 6.6  Electrical Characteristics
    7. 6.7  Safety Limiting Values
    8. 6.8  Safety-Related Certifications
    9. 6.9  Insulation Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 機能ブロック図
    3. 7.3 Feature Description
      1. 7.3.1 Power Stage Operation
        1. 7.3.1.1 VDD-VEE Voltage Regulation
        2. 7.3.1.2 COM-VEE Voltage Regulation
        3. 7.3.1.3 Power Handling Capability
      2. 7.3.2 Output Voltage Soft Start
      3. 7.3.3 ENA and PG
      4. 7.3.4 Protection Functions
        1. 7.3.4.1 Input Undervoltage Lockout
        2. 7.3.4.2 Input Overvoltage Lockout
        3. 7.3.4.3 Output Undervoltage Protection
        4. 7.3.4.4 Output Overvoltage Protection
        5. 7.3.4.5 Overpower Protection
        6. 7.3.4.6 Over-Temperature Protection
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Capacitor Selection
        2. 8.2.2.2 Single RLIM Resistor Selection
        3. 8.2.2.3 RDR Circuit Component Selection
        4. 8.2.2.4 Feedback Resistors Selection
    3. 8.3 System Examples
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 デバイスおよびドキュメントのサポート
    1. 9.1 ドキュメントのサポート
      1. 9.1.1 関連資料
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 商標
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
  13. 12Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

8.2.2 Detailed Design Procedure

Place ceramic decoupling capacitors as close as possible to the device pins. For the input supply, place the capacitors between pins 6 to 7 (VIN) and pins 8 to 9 (GNDP). For the isolated output supply, (VDD – VEE), place the capacitors between pins 28 to 29 (VDD) and pins 30 to 31 (VEE). For the isolated output supply, (COM – VEE), place an RLIM resistor between the RLIM pin and the gate driver COM supply input. Also place decoupling capacitors at the gate driver supply pins (VDD and COM) and at gate driver supply pins (COM and VEE) with values according to the following component calculation sections. These locations are of particular importance to all the decoupling capacitors because the capacitors supply the transient current associated with the fast switching waveforms of the power drive circuits. Ensure the capacitor dielectric material is compatible with the target application temperature.