SLUSDU7 March 2020 UCC21320-Q1
PRODUCTION DATA.
THERMAL METRIC(1) | UCC21320-Q1 | UNIT | |
---|---|---|---|
DWK-14 (SOIC) | |||
RθJA | Junction-to-ambient thermal resistance | 67.3 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 34.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 32.1 | °C/W |
ψJT | Junction-to-top characterization parameter | 18.0 | °C/W |
ψJB | Junction-to-board characterization parameter | 31.6 | °C/W |