JAJSBW9A February   2013  – September 2024 UCC27532

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Thermal Information
    4. 5.4 Electrical Characteristics
    5. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Functional Block Diagram
    2. 6.2 Feature Description
      1. 6.2.1 VDD Under Voltage Lockout
      2. 6.2.2 Input Stage
      3. 6.2.3 Enable Function
      4. 6.2.4 Output Stage
      5. 6.2.5 Power Dissipation
    3. 6.3 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
  9. 8 Layout
    1. 8.1 Layout Guidelines
    2. 8.2 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 サード・パーティ製品に関する免責事項
    2. 9.2 ドキュメントの更新通知を受け取る方法
    3. 9.3 サポート・リソース
    4. 9.4 Trademarks
    5. 9.5 静電気放電に関する注意事項
    6. 9.6 用語集
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DBV|6
サーマルパッド・メカニカル・データ
発注情報

8.2 Thermal Considerations

The useful range of a driver is greatly affected by the drive power requirements of the load and the thermal characteristics of the package. In order for a gate driver to be useful over a particular temperature range the package must allow for the efficient removal of the heat produced while keeping the junction temperature within rated limits. The thermal metrics for the driver package is summarized in the ‘Thermal Information’ section of the datasheet. For detailed information regarding the thermal information table, please refer to Application Note from Texas Instruments entitled “IC Package Thermal Metrics” (SPRA953A).