JAJST72A April   2024  – October 2024 UCC27614-Q1

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Timing Diagrams
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 VDD Undervoltage Lockout
      2. 6.3.2 Input Stage
      3. 6.3.3 Enable Function
      4. 6.3.4 Output Stage
    4. 6.4 Device Functional Modes
  8. 7  Applications and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Driving MOSFET/IGBT/SiC MOSFET
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Input-to-Output Configuration
          2. 7.2.1.2.2 Input Threshold Type
          3. 7.2.1.2.3 VDD Bias Supply Voltage
          4. 7.2.1.2.4 Peak Source and Sink Currents
          5. 7.2.1.2.5 Enable and Disable Function
          6. 7.2.1.2.6 Propagation Delay and Minimum Input Pulse Width
          7. 7.2.1.2.7 Power Dissipation
        3. 7.2.1.3 Application Curves
  9. 8 Power Supply Recommendations
  10. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Example
    3. 9.3 Thermal Consideration
  11. 10Device and Documentation Support
    1. 10.1 サード・パーティ製品に関する免責事項
    2. 10.2 ドキュメントの更新通知を受け取る方法
    3. 10.3 サポート・リソース
    4. 10.4 Trademarks
    5. 10.5 静電気放電に関する注意事項
    6. 10.6 用語集
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • DSG|8
サーマルパッド・メカニカル・データ
発注情報

4 Pin Configuration and Functions

UCC27614-Q1 DSG Package 8-Pin SON Top View Figure 4-1 DSG Package 8-Pin SON Top View
UCC27614-Q1 D Package 8-Pin SOIC Top View Figure 4-2 D Package 8-Pin SOIC Top View
UCC27614-Q1 DGN Package 8-Pin VSSOP Top View Figure 4-3 DGN Package 8-Pin VSSOP Top View
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME DSG NO. D DGN NO.
GND 2,3 4,5 G Device ground or reference
EN — 3 I Enable or disable control pin. If not used, connect to VDD.
IN — 2 I Non-inverting PWM input
IN+ 1 — I Non-inverting PWM input. If not used, connect to VDD.
IN- 8 — I Inverting PWM input. If not used, connect to GND.
OUT 4,5 6,7 O Output of the driver
VDD 6,7 1,8 P Driver bias supply. Connect the positive node of the voltage source to this pin through an impedance for high common mode noise rejection. Bypass this pin with two ceramic capacitors, generally >=1 µF and 0.1 µF, which are referenced to GND pin of this device.
Thermal Pad Thermal Pad(2) — Connect to GND through large copper plane.

This pad is not a low-impedance path to GND.
(1) I/O = Digital input/output, IA = Analog input, AO= Analog output, P = Power connection
(2) Applies to DGN package.