over operating free-air temperature range (unless otherwise noted)(1)(2)(3) | MIN | MAX | UNIT |
---|
Supply voltage, VDD | –0.3 | 30 | V |
Output Voltage, OUTA, OUTB | DC | –0.3 | VDD +0.3 | V |
200ns Pulse | –2 | VDD +3 | V |
Input Voltage INA, INB, ENA, ENB | –10 | 30 | V |
Operating junction temperature, TJ | –40 | 150 | °C |
Lead temperature | Soldering, 10 sec. | | 300 | °C |
Reflow | | 260 |
Storage temperature, Tstg | –65 | 150 | °C |
(1) Operation outside the Absolute Maximum Ratings may cause permanent device
damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any
other conditions beyond those listed under
Recommended Operating Conditions. If outside the
Recommended Operating Conditions but within the
Absolute Maximum Ratings, the device may not be
fully functional, and this may affect device
reliability, functionality, performance, and
shorten the device lifetime.
(2) All voltages are with respect to GND unless otherwise noted. Currents are positive into, negative out of the specified terminal. See
Section 6.4 of the datasheet for thermal limitations and considerations of packages.
(3) These devices are sensitive to electrostatic discharge; follow proper device handling procedures.