SLUS829G August   2008  – February 2020 UCC2897A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Typical Application Diagram
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Detailed Pin Descriptions
        1. 8.3.1.1  RDEL
        2. 8.3.1.2  RON
        3. 8.3.1.3  ROFF
        4. 8.3.1.4  VREF
        5. 8.3.1.5  SYNC
        6. 8.3.1.6  GND
        7. 8.3.1.7  CS
        8. 8.3.1.8  RSLOPE
        9. 8.3.1.9  FB
        10. 8.3.1.10 SS/SD
        11. 8.3.1.11 PGND
        12. 8.3.1.12 AUX
        13. 8.3.1.13 OUT
        14. 8.3.1.14 VDD
        15. 8.3.1.15 LINEUV
        16. 8.3.1.16 VIN
        17. 8.3.1.17 LINEOV
      2. 8.3.2 JFET Control and UVLO
      3. 8.3.3 Line Undervoltage Protection
      4. 8.3.4 Line Overvoltage Protection
      5. 8.3.5 Pulse Skipping
      6. 8.3.6 Synchronization
      7. 8.3.7 Gate Drive Connection
      8. 8.3.8 Bootstrap Biasing
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Oscillator
        2. 9.2.2.2 Soft Start
        3. 9.2.2.3 VDD Bypass Requirements
        4. 9.2.2.4 Delay Programming
        5. 9.2.2.5 Input Voltage Monitoring
        6. 9.2.2.6 Current Sense and Slope Compensation
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
サーマルパッド・メカニカル・データ
発注情報

7.4 Thermal Information

THERMAL METRIC(1) UCC2897A UNIT
QFN (RGP) TSSOP (PW)
20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 34.1 91.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.3 26.3
RθJB Junction-to-board thermal resistance 9.2 42.6
ψJT Junction-to-top characterization parameter 0.4 1.1
ψJB Junction-to-board characterization parameter 9.1 42.1
RθJC(bot) Junction-to-case (bottom) thermal resistance 2.9 N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.