JAJSCI5B august   2016  – march 2022 UCD9090A

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C/Smbus/PMBus Timing Requirements
    7. 6.7 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TI Fusion GUI
      2. 7.3.2 PMBus Interface
      3. 7.3.3 Rail Configuration
    4. 7.4 Device Functional Modes
      1. 7.4.1  Power Supply Sequencing
        1. 7.4.1.1 Turn-On Sequencing
        2. 7.4.1.2 Turn-Off Sequencing
        3. 7.4.1.3 Sequencing Configuration Options
      2. 7.4.2  Pin-Selected Rail States
      3. 7.4.3  Monitoring
        1. 7.4.3.1 Voltage Monitoring
        2. 7.4.3.2 Current Monitoring
        3. 7.4.3.3 Remote Temperature Monitoring and Internal Temperature Sensor
        4. 7.4.3.4 Temperature by Host Input
      4. 7.4.4  Fault Responses and Alert Processing
      5. 7.4.5  Shut Down All Rails and Sequence On (Resequence)
      6. 7.4.6  GPIOs
      7. 7.4.7  GPO Control
      8. 7.4.8  GPO Dependencies
        1. 7.4.8.1 GPO Delays
        2. 7.4.8.2 State Machine Mode Enable
      9. 7.4.9  GPI Special Functions
        1. 7.4.9.1 Fault Shutdown Rails
        2. 7.4.9.2 Configured as Sequencing Debug Pin
        3. 7.4.9.3 Configured as Fault Pin
        4. 7.4.9.4 Cold Boot Mode Enable
      10. 7.4.10 Power Supply Enables
      11. 7.4.11 Cascading Multiple Devices
      12. 7.4.12 PWM Outputs
        1. 7.4.12.1 FPWM1-8
        2. 7.4.12.2 PWM1-2
      13. 7.4.13 Programmable Multiphase PWMs
      14. 7.4.14 Margining
        1. 7.4.14.1 Open-Loop Margining
        2. 7.4.14.2 Closed-Loop Margining
      15. 7.4.15 Run Time Clock
      16. 7.4.16 System Reset Signal
      17. 7.4.17 Watch Dog Timer
      18. 7.4.18 Data and Error Logging to Flash Memory
      19. 7.4.19 Brownout Function
      20. 7.4.20 PMBus Address Selection
      21. 7.4.21 Device Reset
      22. 7.4.22 JTAG Interface
      23. 7.4.23 Internal Fault Management and Memory Error Correction (ECC)
    5. 7.5 Programming
      1. 7.5.1 Full Configuration Update While in Normal Mode
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Estimating ADC Reporting Accuracy
      3. 8.2.3 Application Curves
  10. 9 Power Supply Recommendations
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Mechanical, Packaging, and Orderable Information

パッケージ・オプション

デバイスごとのパッケージ図は、PDF版データシートをご参照ください。

メカニカル・データ（パッケージ｜ピン）
  • RGZ|48
サーマルパッド・メカニカル・データ
発注情報

6.4 Thermal Information

THERMAL METRIC(1)UCD9090AUNIT
RGZ (VQFN)
48 PINS
RθJAJunction-to-ambient thermal resistance25°C/W
RθJC(top)Junction-to-case (top) thermal resistance8.9°C/W
RθJBJunction-to-board thermal resistance5.5°C/W
ψJTJunction-to-top characterization parameter0.3°C/W
ψJBJunction-to-board characterization parameter1.5°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance1.7°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.