JAJS012J October 2004 – November 2018 TPS75003
PRODUCTION DATA.
The TPS75003 device is available in a QFN-style package with an exposed lead frame on the package underside. The exposed lead frame is the primary path for removing heat and should be soldered to a PC board that is configured to remove the amount of power dissipated by the LDO regulator, as calculated by Equation 3.
Power dissipation can be minimized by using the lowest possible input voltage necessary to ensure the required output voltage. The two buck converters do not contribute a significant amount of dissipated power. Using heavier copper will increase the overall effectiveness of removing heat from the device. The addition of plated through-holes to heat-dissipating layers will also improve the heatsink effectiveness.