10.2.2 Detailed Design Procedure
The following is a summarized design procedure:
- Choose between the TPS2412 or 2413, see TPS2412 vs TPS2413 – MOSFET Control Methods.
- Choose the VDD source. Table 3 provides a guide for where to connect VDD that covers most cases. VDD may be directly connected to the supply, but an R(VDD) and C(VDD) of 10 Ω and 0.01 μF is recommended.
Table 3. VDD Connection Guide
VA < 3 V |
3 V ≤ VA ≤ 3.6 V |
VA > 3.6 V |
Bias Supply > 3 V |
VA or Bias Supply > 3 V. VC if always > 3 V |
VC, VA, or Bias for special configurations |
- Noise voltage and impedance at the A pin should be kept low. C(A) may be required if there is noise on the bus, or A is not low impedance. If either of these is a concern, a C(A) of 0.01 μF or more may be required.
- Select C(BYP) as 2200 pF, X7R, 25-V or 50-V ceramic capacitor.
- Select the MOSFET based on considerations of voltage drop, power dissipated, voltage ratings, and gate capacitance. See sections: MOSFET Selection and RSET and TPS2412 Regulation-Loop Stability.
- Select R(RSET) based on which MOSFET was chosen and reverse current considerations – see MOSFET Selection and RSET. If the noise and transient environment is not well known, make provision for R(RSET) even when using the TPS2412.
- Make sure to connect RSVD to ground.