JAJS485F July   2009  – April 2017 TPA3110D2

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and F unctions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Characteristics: 24 V
    6. 7.6 DC Characteristics: 12 V
    7. 7.7 AC Characteristics: 24 V
    8. 7.8 AC Characteristics: 12 V
    9. 7.9 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TPA3110D2 Modulation Scheme
        1. 9.3.1.1 Ferrite Bead Filter Considerations
        2. 9.3.1.2 Efficiency: LC Filter Required With The Traditional Class-D Modulation Scheme
        3. 9.3.1.3 When to Use an Output Filter for EMI Suppression
      2. 9.3.2 Gain Setting Via GAIN0 And GAIN1 Inputs
      3. 9.3.3 Differential Inputs
      4. 9.3.4 PLIMIT
      5. 9.3.5 GVDD Supply
      6. 9.3.6 PBTL Select
      7. 9.3.7 Thermal Protection
      8. 9.3.8 DC Detect
      9. 9.3.9 Short-Circuit Protection and Automatic Recovery Feature
    4. 9.4 Device Functional Modes
      1. 9.4.1 SD Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo Class-D Amplifier With BTL Output and Single-Ended Inputs With Power Limiting
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Input Resistance
          2. 10.2.1.2.2 Input Capacitor, CI
          3. 10.2.1.2.3 BSN and BSP Capacitors
          4. 10.2.1.2.4 Using Low-ESR Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Stereo Class-D Amplifier With PBTL Output and Single-Ended Input
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 開発サポート
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 コミュニティ・リソース
    4. 13.4 商標
    5. 13.5 静電気放電に関する注意事項
    6. 13.6 Glossary
  14. 14メカニカル、パッケージ、および注文情報

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage AVCC, PVCC –0.3 V 30 V V
VI Interface pin voltage SD, GAIN0, GAIN1, PBTL, FAULT (2) –0.3 V VCC + 0.3 V V
< 10 V/ms
PLIMIT –0.3 GVDD + 0.3 V
RINN, RINP, LINN, LINP –0.3 6.3 V
Continuous total power dissipation See Thermal Information
RL Minimum Load Resistance BTL: PVCC > 15 V 4.8
BTL: PVCC ≤ 15 V 3.2
PBTL 3.2
TA Operating free-air temperature –40 85 °C
TJ Operating junction temperature range(3) –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The voltage slew rate of these pins must be restricted to no more than 10 V/ms. For higher slew rates, use a 100-kΩ resister in series with the pins.
(3) The TPA3110D2 incorporates an exposed thermal pad on the underside of the chip. This acts as a heatsink, and it must be connected to a thermally dissipating plane for proper power dissipation. Failure to do so may result in the device going into thermal protection shutdown. See TI Technical Briefs SLMA002 for more information about using the TSSOP thermal pad.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage PVCC, AVCC 8 26 V
VIH High-level input voltage SD, GAIN0, GAIN1, PBTL 2 V
VIL Low-level input voltage SD, GAIN0, GAIN1, PBTL 0.8 V
VOL Low-level output voltage FAULT, RPULL-UP= 100 k, VCC= 26 V 0.8 V
IIH High-level input current SD, GAIN0, GAIN1, PBTL, VI = 2 V, VCC = 18 V 50 µA
IIL Low-level input current SD, GAIN0, GAIN1, PBTL, VI = 0.8 V, VCC = 18 V 5 µA
TA Operating free-air temperature –40 85 °C

7.4 Thermal Information

THERMAL METRIC(1) TPA3110D2 UNIT
PWP (HTSSOP)
28 PINS
RθJA Junction-to-ambient thermal resistance 30.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 33.5 °C/W
RθJB Junction-to-board thermal resistance 17.5 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 7.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 DC Characteristics: 24 V

TA = 25°C, VCC = 24 V, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
| VOS | Class-D output offset voltage (measured differentially) VI = 0 V, Gain = 36 dB 1.5 15 mV
ICC Quiescent supply current SD = 2 V, no load, PVCC = 24 V 32 50 mA
ICC(SD) Quiescent supply current in shutdown mode SD = 0.8 V, no load, PVCC = 24 V 250 400 µA
rDS(on) Drain-source on-state resistance VCC = 12 V, IO = 500 mA,
TJ = 25°C		 High Side 240 mΩ
Low side 240
G Gain GAIN1 = 0.8 V GAIN0 = 0.8 V 19 20 21 dB
GAIN0 = 2 V 25 26 27
GAIN1 = 2 V GAIN0 = 0.8 V 31 32 33 dB
GAIN0 = 2 V 35 36 37
ton Turn-on time SD = 2 V 14 ms
tOFF Turn-off time SD = 0.8 V 2 μs
GVDD Gate Drive Supply IGVDD = 100 μA 6.4 6.9 7.4 V
tDCDET DC Detect time V(RINN) = 6 V, VRINP = 0 V 420 ms

7.6 DC Characteristics: 12 V

TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
| VOS | Class-D output offset voltage (measured differentially) VI = 0 V, Gain = 36 dB 1.5 15 mV
ICC Quiescent supply current SD = 2 V, no load, PVCC = 12V 20 35 mA
ICC(SD) Quiescent supply current in shutdown mode SD = 0.8 V, no load, PVCC = 12V 200 µA
rDS(on) Drain-source on-state resistance VCC = 12 V, IO = 500 mA,
TJ = 25°C		 High Side 240 mΩ
Low side 240
G Gain GAIN1 = 0.8 V GAIN0 = 0.8 V 19 20 21 dB
GAIN0 = 2 V 25 26 27
GAIN1 = 2 V GAIN0 = 0.8 V 31 32 33 dB
GAIN0 = 2 V 35 36 37
tON Turn-on time SD = 2 V 14 ms
tOFF Turn-off time SD = 0.8 V 2 μs
GVDD Gate Drive Supply IGVDD = 2 mA 6.4 6.9 7.4 V
VO Output Voltage maximum under PLIMIT control V(PLIMIT) = 2 V; VI = 1 V rms 6.75 7.90 8.75 V

7.7 AC Characteristics: 24 V

TA = 25°C, VCC = 24 V, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
KSVR Power Supply ripple rejection 200 mVPP ripple at 1 kHz,
Gain = 20 dB, Inputs ac-coupled to AGND		 –70 dB
PO Continuous output power THD+N = 10%, f = 1 kHz, VCC = 16 V 15 W
THD+N Total harmonic distortion + noise VCC = 16 V, f = 1 kHz, PO = 7.5 W (half-power) 0.1%
Vn Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB 65 µV
–80 dBV
Crosstalk VO = 1 Vrms, Gain = 20 dB, f = 1 kHz –100 dB
SNR Signal-to-noise ratio Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted		 102 dB
fOSC Oscillator frequency 250 310 350 kHz
Thermal trip point 150 °C
Thermal hysteresis 15 °C

7.8 AC Characteristics: 12 V

TA = 25°C, VCC = 12 V, RL = 8 Ω (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
KSVR Supply ripple rejection 200 mVPP ripple from 20 Hz–1 kHz,
Gain = 20 dB, Inputs ac-coupled to AGND		 –70 dB
PO Continuous output power THD+N = 10%, f = 1 kHz; VCC = 13 V 10 W
THD+N Total harmonic distortion + noise RL = 8 Ω, f = 1 kHz, PO = 5 W (half-power) 0.06%
Vn Output integrated noise 20 Hz to 22 kHz, A-weighted filter, Gain = 20 dB 65 µV
–80 dBV
Crosstalk Po = 1 W, Gain = 20 dB, f = 1 kHz –100 dB
SNR Signal-to-noise ratio Maximum output at THD+N < 1%, f = 1 kHz,
Gain = 20 dB, A-weighted		 102 dB
fOSC Oscillator frequency 250 310 350 kHz
Thermal trip point 150 °C
Thermal hysteresis 15 °C

7.9 Typical Characteristics

All Measurements taken at 1 kHz, unless otherwise noted. Measurements were made using the TPA3110D2 EVM which is available at www.ti.com.
TPA3110D2 g001_los528.gif Figure 1. Total Harmonic Distortion vs Frequency (BTL)
TPA3110D2 g003_los528.gif Figure 3. Total Harmonic Distortion vs Frequency (BTL)
TPA3110D2 g005_los528.gif Figure 5. Total Harmonic Distortion vs Frequency (BTL)
TPA3110D2 g007_los528.gif Figure 7. Total Harmonic Distortion + Noise vs Output Power (BTL)
TPA3110D2 g009_los528.gif Figure 9. Total Harmonic Distortion + Noise vs Output Power (BTL)
TPA3110D2 g011_los528.gif Figure 11. Total Harmonic Distortion + Noise vs Output Power (BTL)
TPA3110D2 g013_los528.gif
SPACE
Figure 13. Maximum Output Power vs PLIMIT Voltage (BTL)
TPA3110D2 g015_los528.gif
SPACE
Figure 15. Gain and Phase vs Frequency (BTL)
TPA3110D2 D034_SLOS528E.gif
1. The figure is measured with heatsink(1) on EVM(2)
Figure 17. Output Power vs Supply Voltage (BTL)
TPA3110D2 g018_los528.gif
Note: Dashed Lines represent thermally limited regions.
Figure 19. Efficiency vs Output Power (BTL)
TPA3110D2 g019_los528.gif
Note: Dashed Lines represent thermally limited regions.
Figure 21. Efficiency vs Output Power (BTL)
TPA3110D2 g020_los528.gif Figure 23. Efficiency vs Output Power (BTL)
TPA3110D2 g021_los528.gif
Note: Dashed Lines represent thermally limited regions.
Figure 25. Supply Current vs Total Output Power (BTL)
TPA3110D2 g023_los528.gif
SPACE
Figure 27. Crosstalk vs Frequency (BTL)
TPA3110D2 g025_los528.gif Figure 29. Total Harmonic Distortion vs Frequency (PBTL)
TPA3110D2 g027_los528.gif Figure 31. Gain and Phase vs Frequency (PBTL)
TPA3110D2 g029_los528.gif
SPACE
Figure 33. Efficiency vs Output Power (PBTL)
TPA3110D2 g031_los528.gif Figure 35. Supply Ripple Rejection Ratio vs Frequency (PBTL)
TPA3110D2 g002_los528.gif Figure 2. Total Harmonic Distortion vs Frequency (BTL)
TPA3110D2 g004_los528.gif Figure 4. Total Harmonic Distortion vs Frequency (BTL)
TPA3110D2 g006_los528.gif Figure 6. Total Harmonic Distortion vs Frequency (BTL)
TPA3110D2 g008_los528.gif Figure 8. Total Harmonic Distortion + Noise vs Output Power (BTL)
TPA3110D2 g010_los528.gif Figure 10. Total Harmonic Distortion + Noise vs Output Power (BTL)
TPA3110D2 g012_los528.gif Figure 12. Total Harmonic Distortion + Noise vs Output Power (BTL)
TPA3110D2 g014_los528.gif
Note: Dashed Lines represent thermally limited regions.
Figure 14. Output Power vs PLIMIT Voltage (BTL)
TPA3110D2 D035_SLOS528E.gif
1. The figure is measured with heatsink(1) on EVM(2)
Figure 16. Output Power vs Supply Voltage (BTL)
TPA3110D2 D033_SLOS528E.gif
1. The figure is measured with heatsink(1) on EVM(2)
Figure 18. Output Power vs Supply Voltage (BTL)
TPA3110D2 g032_los528.gif
SPACE
Figure 20. Efficiency vs Output Power (BTL With LC Filter)
TPA3110D2 g033_los528.gif Figure 22. Efficiency vs Output Power (BTL With LC Filter)
TPA3110D2 g034_los528.gif
SPACE
Figure 24. Efficiency vs Output Power (BTL With LC Filter)
TPA3110D2 g022_los528.gif
Note: Dashed Lines represent thermally limited regions.
Figure 26. Supply Current vs Total Output Power (BTL)
TPA3110D2 g024_los528.gif Figure 28. Supply Ripple Rejection Ratio vs Frequency (BTL)
TPA3110D2 g026_los528.gif Figure 30. Total Harmonic Distortion + Noise vs Output Power (PBTL)
TPA3110D2 D036_SLOS528E.gif
1. The figure is measured with heatsink(1) on EVM(2)
Figure 32. Output Power vs Supply Voltage (PBTL)
TPA3110D2 g030_los528.gif Figure 34. Supply Current vs Output Power (PBTL)
1.
2.