JAJSDN5E December   2016  – December 2023 LMK62A2-100M , LMK62A2-150M , LMK62A2-156M , LMK62A2-200M , LMK62A2-266M , LMK62E0-156M , LMK62E2-100M , LMK62E2-156M , LMK62I0-100M , LMK62I0-156M

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - Power Supply
    6. 5.6  LVPECL Output Characteristics
    7. 5.7  LVDS Output Characteristics
    8. 5.8  HCSL Output Characteristics
    9. 5.9  OE Input Characteristics
    10. 5.10 Frequency Tolerance Characteristics
    11. 5.11 Power-On/Reset Characteristics (VDD)
    12. 5.12 PSRR Characteristics
    13. 5.13 PLL Clock Output Jitter Characteristics
    14. 5.14 Additional Reliability and Qualification
  7. 6 Parameter Measurement Information
    1. 6.1 Device Output Configurations
  8. 7 Application and Implementation
    1. 7.1 Power Supply Recommendations
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
        1. 7.2.1.1 Ensuring Thermal Reliability
        2. 7.2.1.2 Best Practices for Signal Integrity
        3. 7.2.1.3 Recommended Solder Reflow Profile
  9. 8 Device and Documentation Support
    1. 8.1 ドキュメントの更新通知を受け取る方法
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

7.2.1.3 Recommended Solder Reflow Profile

TI recommends following the recommendations set by the solder paste supplier to optimize flux activity and to achieve proper melting temperatures of the alloy within the guidelines of J-STD-20. Processing LMK62XX with the lowest peak temperature possible while also remaining below the components peak temperature rating as listed on the MSL label is preferred. The exact temperature profile would depend on several factors including maximum peak temperature for the component as rated on the MSL label, board thickness, PCB material type, PCB geometries, component locations, sizes, densities within PCB, as well as the recommended soldering profile from the manufacturer, and capability of the reflow equipment to as confirmed by the SMT assembly operation.