JAJSDN6C December   2016  – December 2017 LMK60E0-156M , LMK60E0-212M , LMK60E2-100M , LMK60E2-125M , LMK60E2-156M , LMK60I2-100M , LMK60I2-322M

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Supply
    6. 6.6  LVPECL Output Characteristics
    7. 6.7  LVDS Output Characteristics
    8. 6.8  HCSL Output Characteristics
    9. 6.9  OE Input Characteristics
    10. 6.10 Frequency Tolerance Characteristics
    11. 6.11 Power-On/Reset Characteristics (VDD)
    12. 6.12 PSRR Characteristics
    13. 6.13 PLL Clock Output Jitter Characteristics
    14. 6.14 Additional Reliability and Qualification
  7. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  8. 8 Power Supply Recommendations
  9. 9 Layout
    1. 9.1 Layout Guidelines
      1. 9.1.1 Ensuring Thermal Reliability
      2. 9.1.2 Best Practices for Signal Integrity
      3. 9.1.3 Recommended Solder Reflow Profile
  10. 10デバイスおよびドキュメントのサポート
    1. 10.1 ドキュメントの更新通知を受け取る方法
    2. 10.2 コミュニティ・リソース
    3. 10.3 商標
    4. 10.4 静電気放電に関する注意事項
    5. 10.5 Glossary
  11. 11メカニカル、パッケージ、および注文情報

8 Power Supply Recommendations

For best electrical performance of LMK60EX, TI recommends using a combination of 10 µF, 1 µF, and 0.1 µF on its power-supply bypass network. TI also recommends using component side mounting of the power-supply bypass capacitors and it is best to use 0201 or 0402 body size capacitors to facilitate signal routing. Keep the connections between the bypass capacitors and the power supply on the device as short as possible. Ground the other side of the capacitor using a low impedance connection to the ground plane. Figure 9 shows the layout recommendation for power supply decoupling of LMK60EX.