Figure 11-1 illustrates an example of a PCB layout with the TIC12400-Q1. Some key
considerations are:
Decouple the VS and VDD pins with capacitor using
recommended values from section Power Supply Recommendations and place them as close to the
pin as possible. Make sure that the capacitor voltage rating is sufficient for
the VS and VDD supplies.
Keep the input lines as short as possible.
Use a solid ground plane to help distribute heat and reduce electromagnetic
interference (EMI) noise pickup.
Do not run sensitive analog traces in parallel with digital traces. Avoid
crossing digital and analog traces if possible, and only make perpendicular
crossings when necessary.
To achieve good thermal performance, the exposed thermal pad underneath the
device must be soldered to the board and flooded with vias to ground planes. For
simple double-sided PCBs where there are no internal layers, the surface layers
can be used to remove heat. For multilayer PCBs, internal ground planes can be
used for heat removal.
Minimize the inductive parasitic between the INx input capacitors and the
thermal pad ground return.