JAJSDX8E June   2017  – August 2018 ISO1211 , ISO1212

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      アプリケーション図
      2.      従来のソリューションと比較した、ISO121xデバイスによる基板の温度の低下
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
    2.     Pin Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—DC Specification
    10. 7.10 Switching Characteristics—AC Specification
    11. 7.11 Insulation Characteristics Curves
    12. 7.12 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Test Circuits
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
    4. 9.4 Device Functional Modes
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Sinking Inputs
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Setting Current Limit and Voltage Thresholds
          2. 10.2.1.2.2 Thermal Considerations
          3. 10.2.1.2.3 Designing for 48-V Systems
          4. 10.2.1.2.4 Designing for Input Voltages Greater Than 60 V
          5. 10.2.1.2.5 Surge, ESD, and EFT Tests
          6. 10.2.1.2.6 Multiplexing the Interface to the Host Controller
          7. 10.2.1.2.7 Status LEDs
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Sourcing Inputs
      3. 10.2.3 Sourcing and Sinking Inputs (Bidirectional Inputs)
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 開発サポート
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 関連リンク
    4. 13.4 ドキュメントの更新通知を受け取る方法
    5. 13.5 コミュニティ・リソース
    6. 13.6 商標
    7. 13.7 静電気放電に関する注意事項
    8. 13.8 Glossary
  14. 14メカニカル、パッケージ、および注文情報

7.4 Thermal Information

THERMAL METRIC(1) ISO1211 ISO1212 UNIT
D (SOIC) DBQ (SSOP)
8 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 146.1 116.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 63.1 56.5 °C/W
RθJB Junction-to-board thermal resistance 80 64.7 °C/W
ΨJT Junction-to-top characterization parameter 9.6 27.9 °C/W
ΨJB Junction-to-board characterization parameter 79 64.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.