JAJSE32B October 2017 – January 2019 LMX2572
PRODUCTION DATA.
THERMAL METRIC(1) | LMX2572 | UNIT | |
---|---|---|---|
RHA (VQFN) | |||
40 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 25.5 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 14.4 | °C/W |
RθJB | Junction-to-board thermal resistance | 8.0 | °C/W |
ΨJT | Junction-to-top characterization parameter | 0.2 | °C/W |
ΨJB | Junction-to-board characterization parameter | 7.9 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | 1.2 | °C/W |