JAJSE43E
March 2017 – May 2021
CC3120MOD
PRODUCTION DATA
1
特長
2
アプリケーション
3
概要
4
機能ブロック図
5
Revision History
6
Device Comparison
6.1
Related Products
7
Terminal Configuration and Functions
7.1
CC3120MOD Pin Diagram
7.2
Pin Attributes
11
7.3
Connections for Unused Pins
8
Specifications
8.1
Absolute Maximum Ratings
8.2
ESD Ratings
8.3
Recommended Operating Conditions
8.4
Current Consumption Summary
8.5
TX Power and IBAT versus TX Power Level Settings
8.6
Brownout and Blackout Conditions
8.7
Electrical Characteristics
8.8
WLAN Receiver Characteristics
8.9
WLAN Transmitter Characteristics
8.10
Reset Requirement
8.11
Thermal Resistance Characteristics for MOB Package
8.12
Timing and Switching Characteristics
8.12.1
Power-Up Sequencing
8.12.2
Power-Down Sequencing
8.12.3
Device Reset
8.12.4
Wakeup From HIBERNATE Mode Timing
8.13
External Interfaces
8.13.1
SPI Host Interface
8.13.2
Host UART Interface
8.13.2.1
5-Wire UART Topology
8.13.2.2
4-Wire UART Topology
8.13.2.3
3-Wire UART Topology
8.13.3
External Flash Interface
9
Detailed Description
9.1
Overview
9.2
Module Features
9.2.1
WLAN
9.2.2
Network Stack
9.2.2.1
Security
9.2.3
Host Interface and Driver
9.2.4
System
9.3
Power-Management Subsystem
9.3.1
VBAT Wide-Voltage Connection
9.4
Low-Power Operating Modes
9.4.1
Low-Power Deep Sleep
9.4.2
Hibernate
9.4.3
Shutdown
9.5
Restoring Factory Default Configuration
9.6
Device Certification and Qualification
9.6.1
FCC Certification and Statement
9.6.2
Industry Canada (IC) Certification and Statement
9.6.3
ETSI/CE Certification
9.6.4
Japan MIC Certification
9.6.5
SRRC Certification and Statement
9.7
Module Markings
9.8
End Product Labeling
9.9
Manual Information to the End User
10
Applications, Implementation, and Layout
10.1
Application Information
10.1.1
Typical Application
10.1.2
Power Supply Decoupling and Bulk Capacitors
10.1.3
Reset
10.1.4
Unused Pins
10.2
PCB Layout Guidelines
10.2.1
General Layout Recommendations
10.2.2
RF Layout Recommendations
10.2.3
Antenna Placement and Routing
10.2.4
Transmission Line Considerations
11
Environmental Requirements and Specifications
11.1
Temperature
11.1.1
PCB Bending
11.2
Handling Environment
11.2.1
Terminals
11.2.2
Falling
11.3
Storage Condition
11.3.1
Moisture Barrier Bag Before Opened
11.3.2
Moisture Barrier Bag Open
11.4
Baking Conditions
11.5
Soldering and Reflow Condition
12
Device and Documentation Support
12.1
Device Nomenclature
12.2
Development Tools and Software
12.3
Firmware Updates
12.4
Documentation Support
12.5
Trademarks
12.6
Electrostatic Discharge Caution
12.7
Glossary
13
Mechanical, Packaging, and Orderable Information
13.1
Mechanical, Land, and Solder Paste Drawings
13.2
Package Option Addendum
13.2.1
Packaging Information
13.3
Tape and Reel Information
13.3.1
Tape and Reel Specification
11
Environmental Requirements and Specifications