JAJSE43E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

  1. 特長
  2. アプリケーション
  3. 概要
  4. 機能ブロック図
  5. Revision History
  6. Device Comparison
    1. 6.1 Related Products
  7. Terminal Configuration and Functions
    1. 7.1 CC3120MOD Pin Diagram
    2. 7.2 Pin Attributes
      1.      11
    3. 7.3 Connections for Unused Pins
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Current Consumption Summary
    5. 8.5  TX Power and IBAT versus TX Power Level Settings
    6. 8.6  Brownout and Blackout Conditions
    7. 8.7  Electrical Characteristics
    8. 8.8  WLAN Receiver Characteristics
    9. 8.9  WLAN Transmitter Characteristics
    10. 8.10 Reset Requirement
    11. 8.11 Thermal Resistance Characteristics for MOB Package
    12. 8.12 Timing and Switching Characteristics
      1. 8.12.1 Power-Up Sequencing
      2. 8.12.2 Power-Down Sequencing
      3. 8.12.3 Device Reset
      4. 8.12.4 Wakeup From HIBERNATE Mode Timing
    13. 8.13 External Interfaces
      1. 8.13.1 SPI Host Interface
      2. 8.13.2 Host UART Interface
        1. 8.13.2.1 5-Wire UART Topology
        2. 8.13.2.2 4-Wire UART Topology
        3. 8.13.2.3 3-Wire UART Topology
      3. 8.13.3 External Flash Interface
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
        1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
    3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
    4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
    5. 9.5 Restoring Factory Default Configuration
    6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
    7. 9.7 Module Markings
    8. 9.8 End Product Labeling
    9. 9.9 Manual Information to the End User
  10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
      1. 10.1.1 Typical Application
      2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
      3. 10.1.3 Reset
      4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
      1. 10.2.1 General Layout Recommendations
      2. 10.2.2 RF Layout Recommendations
      3. 10.2.3 Antenna Placement and Routing
      4. 10.2.4 Transmission Line Considerations
  11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
      1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
      1. 11.2.1 Terminals
      2. 11.2.2 Falling
    3. 11.3 Storage Condition
      1. 11.3.1 Moisture Barrier Bag Before Opened
      2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
      1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
      1. 13.3.1 Tape and Reel Specification

SPI Host Interface

The device interfaces to an external host using the SPI. The CC3120MOD module can interrupt the host using the HOST_INTR line to initiate the data transfer over the interface. The SPI host interface can work up to a speed of 20 MHz.

Figure 8-8 shows the SPI host interface.

GUID-67374585-8E52-4FC4-92B1-5D7343B8FC8F-low.gifFigure 8-8 SPI Host Interface

 

Table 8-4 lists the SPI host interface pins.

Table 8-4 SPI Host Interface
PIN NAMEDESCRIPTION
HOST_SPI_CLKClock (up to 20 MHz) from MCU host to CC3120MOD module
HOST_SPI_nCSCS (active low) signal from MCU host to CC3120MOD module
HOST_SPI_MOSIData from MCU host to CC3120MOD module
HOST_INTRInterrupt from CC3120MOD module to MCU host
HOST_SPI_MISOData from CC3120MOD module to MCU host
nHIBActive-low signal that commands the CC3120MOD module to enter hibernate mode (lowest power state)

Figure 8-9 shows the host SPI timing diagram.

GUID-FE3600EE-A464-45DB-BDA7-932A8B9365C6-low.gifFigure 8-9 Host SPI Timing

Table 8-5 lists the host SPI timing parameters.

Table 8-5 Host SPI Timing Parameters
PARAMETER NUMBERDESCRIPTIONMINMAXUNIT
T1F(1)Clock frequency at VBAT = 3.3 V20MHz
Clock frequency at VBAT = 2.3 V12
T2tclk(1)(2)Clock period50ns
T3tLP(1)Clock low period25ns
T4tHT(1)Clock high period25ns
T5D(1)Duty cycle45%55%
T6tIS(1)RX data setup time4ns
T7tIH(1)RX data hold time4ns
T8tOD(1)TX data output delay20ns
T9tOH(1)TX data hold time24ns
The timing parameter has a maximum load of 20 pf at 3.3 V.
Ensure that nCS (active-low signal) is asserted 10 ns before the clock is toggled. The nCS signal can be deasserted 10 ns after the clock edge.