JAJSE43E March   2017  – May 2021 CC3120MOD

PRODUCTION DATA  

1. 1 特長
2. 2 アプリケーション
3. 3 概要
4. 4 機能ブロック図
5. 5 Revision History
6. 6 Device Comparison
   1. 6.1 Related Products
7. 7 Terminal Configuration and Functions
   1. 7.1 CC3120MOD Pin Diagram
   2. 7.2 Pin Attributes
      1.      11
   3. 7.3 Connections for Unused Pins
8. 8 Specifications
   1. 8.1  Absolute Maximum Ratings
   2. 8.2  ESD Ratings
   3. 8.3  Recommended Operating Conditions
   4. 8.4  Current Consumption Summary
   5. 8.5  TX Power and IBAT versus TX Power Level Settings
   6. 8.6  Brownout and Blackout Conditions
   7. 8.7  Electrical Characteristics
   8. 8.8  WLAN Receiver Characteristics
   9. 8.9  WLAN Transmitter Characteristics
   10. 8.10 Reset Requirement
   11. 8.11 Thermal Resistance Characteristics for MOB Package
   12. 8.12 Timing and Switching Characteristics
       1. 8.12.1 Power-Up Sequencing
       2. 8.12.2 Power-Down Sequencing
       3. 8.12.3 Device Reset
       4. 8.12.4 Wakeup From HIBERNATE Mode Timing
   13. 8.13 External Interfaces
       1. 8.13.1 SPI Host Interface
       2. 8.13.2 Host UART Interface
          1. 8.13.2.1 5-Wire UART Topology
          2. 8.13.2.2 4-Wire UART Topology
          3. 8.13.2.3 3-Wire UART Topology
       3. 8.13.3 External Flash Interface
9. 9 Detailed Description
   1. 9.1 Overview
   2. 9.2 Module Features
      1. 9.2.1 WLAN
      2. 9.2.2 Network Stack
         1. 9.2.2.1 Security
      3. 9.2.3 Host Interface and Driver
      4. 9.2.4 System
   3. 9.3 Power-Management Subsystem
      1. 9.3.1 VBAT Wide-Voltage Connection
   4. 9.4 Low-Power Operating Modes
      1. 9.4.1 Low-Power Deep Sleep
      2. 9.4.2 Hibernate
      3. 9.4.3 Shutdown
   5. 9.5 Restoring Factory Default Configuration
   6. 9.6 Device Certification and Qualification
      1. 9.6.1 FCC Certification and Statement
      2. 9.6.2 Industry Canada (IC) Certification and Statement
      3. 9.6.3 ETSI/CE Certification
      4. 9.6.4 Japan MIC Certification
      5. 9.6.5 SRRC Certification and Statement
   7. 9.7 Module Markings
   8. 9.8 End Product Labeling
   9. 9.9 Manual Information to the End User
10. 10Applications, Implementation, and Layout
    1. 10.1 Application Information
       1. 10.1.1 Typical Application
       2. 10.1.2 Power Supply Decoupling and Bulk Capacitors
       3. 10.1.3 Reset
       4. 10.1.4 Unused Pins
    2. 10.2 PCB Layout Guidelines
       1. 10.2.1 General Layout Recommendations
       2. 10.2.2 RF Layout Recommendations
       3. 10.2.3 Antenna Placement and Routing
       4. 10.2.4 Transmission Line Considerations
11. 11Environmental Requirements and Specifications
    1. 11.1 Temperature
       1. 11.1.1 PCB Bending
    2. 11.2 Handling Environment
       1. 11.2.1 Terminals
       2. 11.2.2 Falling
    3. 11.3 Storage Condition
       1. 11.3.1 Moisture Barrier Bag Before Opened
       2. 11.3.2 Moisture Barrier Bag Open
    4. 11.4 Baking Conditions
    5. 11.5 Soldering and Reflow Condition
12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Development Tools and Software
    3. 12.3 Firmware Updates
    4. 12.4 Documentation Support
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Mechanical, Land, and Solder Paste Drawings
    2. 13.2 Package Option Addendum
       1. 13.2.1 Packaging Information
    3. 13.3 Tape and Reel Information
       1. 13.3.1 Tape and Reel Specification