JAJSES5Q July   2006  – August 2024 TLK2711-SP

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 TTL Input Electrical Characteristics
    6. 5.6 Transmitter/Receiver Electrical Characteristics
    7. 5.7 Reference Clock (TXCLK) Timing Requirements
    8. 5.8 TTL Output Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Transmit Interface
      2. 6.3.2  Transmit Data Bus
      3. 6.3.3  Data Transmission Latency
      4. 6.3.4  8-Bit/10-Bit Encoder
      5. 6.3.5  Pseudo-Random Bit Stream (PRBS) Generator
      6. 6.3.6  Parallel to Serial
      7. 6.3.7  High-Speed Data Output
      8. 6.3.8  Receive Interface
      9. 6.3.9  Receive Data Bus
      10. 6.3.10 Data Reception Latency
      11. 6.3.11 Serial to Parallel
      12. 6.3.12 Comma Detect and 8-Bit/10-Bit Decoding
      13. 6.3.13 LOS Detection
      14. 6.3.14 PRBS Verification
      15. 6.3.15 Reference Clock Input
      16. 6.3.16 Operating Frequency Range
      17. 6.3.17 Testability
      18. 6.3.18 Loopback Testing
      19. 6.3.19 BIST
      20. 6.3.20 Power-On Reset
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Mode
      2. 6.4.2 High-Speed I/O Directly-Coupled Mode
      3. 6.4.3 High-Speed I/O AC-Coupled Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 ドキュメントの更新通知を受け取る方法
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)TLK2711-SPUNIT
HFG (CFP)
68 PINS
RθJA Junction-to-ambient thermal resistance 36.2 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.8 °C/W
RθJB Junction-to-board thermal resistance 23.6 °C/W
ΨJT Junction-to-top characterization parameter 14.3 °C/W
ΨJB Junction-to-board characterization parameter 23.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 9.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.