JAJSF60A April   2018  – December 2018 TPS746

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーション
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout (UVLO)
      2. 8.3.2 Shutdown
      3. 8.3.3 Foldback Current Limit
      4. 8.3.4 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Functional Mode Comparison
      2. 8.4.2 Normal Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Disabled
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Adjustable Device Feedback Resistors
      2. 9.1.2 Input and Output Capacitor Selection
      3. 9.1.3 Dropout Voltage
      4. 9.1.4 Exiting Dropout
      5. 9.1.5 Reverse Current
      6. 9.1.6 Power Dissipation (PD)
      7. 9.1.7 Power-Good Function
    2. 9.2 Feed-Forward Capacitor (CFF)
    3. 9.3 Typical Application
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Input Current
        2. 9.3.2.2 Thermal Dissipation
      3. 9.3.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12デバイスおよびドキュメントのサポート
    1. 12.1 ドキュメントのサポート
      1. 12.1.1 関連資料
    2. 12.2 ドキュメントの更新通知を受け取る方法
    3. 12.3 コミュニティ・リソース
    4. 12.4 商標
    5. 12.5 静電気放電に関する注意事項
    6. 12.6 Glossary
  13. 13メカニカル、パッケージ、および注文情報

7.4 Thermal Information

THERMAL METRIC(1) TPS746 UNIT
DRV (WSON)
6 PINS
RθJA Junction-to-ambient thermal resistance 80.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 98.7 °C/W
RθJB Junction-to-board thermal resistance 44.8 °C/W
ψJT Junction-to-top characterization parameter 6.1 °C/W
ψJB Junction-to-board characterization parameter 45.0 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 20.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.