JAJSF69A April   2018  – October 2018 ADS112C04

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      Kタイプ熱電対温度の測定
  4. 4 概要（続き）
  5. 5 改訂履歴
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 I2C Timing Requirements
    7. 7.7 I2C Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Multiplexer
      2. 9.3.2  Low-Noise Programmable Gain Stage
        1. 9.3.2.1 PGA Input Voltage Requirements
        2. 9.3.2.2 Bypassing the PGA
      3. 9.3.3  Voltage Reference
      4. 9.3.4  Modulator and Internal Oscillator
      5. 9.3.5  Digital Filter
      6. 9.3.6  Conversion Times
      7. 9.3.7  Excitation Current Sources
      8. 9.3.8  Sensor Detection
      9. 9.3.9  System Monitor
      10. 9.3.10 Temperature Sensor
        1. 9.3.10.1 Converting From Temperature to Digital Codes
          1. 9.3.10.1.1 For Positive Temperatures (For Example, 50°C):
          2. 9.3.10.1.2 For Negative Temperatures (For Example, –25°C):
        2. 9.3.10.2 Converting From Digital Codes to Temperature
      11. 9.3.11 Offset Calibration
      12. 9.3.12 Conversion Data Counter
      13. 9.3.13 Data Integrity Features
    4. 9.4 Device Functional Modes
      1. 9.4.1 Power-Up and Reset
        1. 9.4.1.1 Power-On Reset
        2. 9.4.1.2 RESET Pin
        3. 9.4.1.3 Reset by Command
      2. 9.4.2 Conversion Modes
        1. 9.4.2.1 Single-Shot Conversion Mode
        2. 9.4.2.2 Continuous Conversion Mode
      3. 9.4.3 Operating Modes
        1. 9.4.3.1 Normal Mode
        2. 9.4.3.2 Turbo Mode
        3. 9.4.3.3 Power-Down Mode
    5. 9.5 Programming
      1. 9.5.1 I2C Interface
        1. 9.5.1.1 I2C Address
        2. 9.5.1.2 Serial Clock (SCL) and Serial Data (SDA)
        3. 9.5.1.3 Data Ready (DRDY)
        4. 9.5.1.4 Interface Speed
        5. 9.5.1.5 Data Transfer Protocol
        6. 9.5.1.6 I2C General Call (Software Reset)
        7. 9.5.1.7 Timeout
      2. 9.5.2 Data Format
      3. 9.5.3 Commands
        1. 9.5.3.1 Command Latching
        2. 9.5.3.2 RESET (0000 011x)
        3. 9.5.3.3 START/SYNC (0000 100x)
        4. 9.5.3.4 POWERDOWN (0000 001x)
        5. 9.5.3.5 RDATA (0001 xxxx)
        6. 9.5.3.6 RREG (0010 rrxx)
        7. 9.5.3.7 WREG (0100 rrxx dddd dddd)
      4. 9.5.4 Reading Data and Monitoring for New Conversion Results
      5. 9.5.5 Data Integrity
    6. 9.6 Register Map
      1. 9.6.1 Configuration Registers
      2. 9.6.2 Register Descriptions
        1. 9.6.2.1 Configuration Register 0 (address = 00h) [reset = 00h]
          1. Table 19. Configuration Register 0 Field Descriptions
        2. 9.6.2.2 Configuration Register 1 (address = 01h) [reset = 00h]
          1. Table 20. Configuration Register 1 Field Descriptions
        3. 9.6.2.3 Configuration Register 2 (address = 02h) [reset = 00h]
          1. Table 22. Configuration Register 2 Field Descriptions
        4. 9.6.2.4 Configuration Register 3 (address = 03h) [reset = 00h]
          1. Table 23. Configuration Register 3 Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Interface Connections
      2. 10.1.2 Connecting Multiple Devices on the Same I2C Bus
      3. 10.1.3 Unused Inputs and Outputs
      4. 10.1.4 Analog Input Filtering
      5. 10.1.5 External Reference and Ratiometric Measurements
      6. 10.1.6 Establishing Proper Limits on the Absolute Input Voltage
      7. 10.1.7 Pseudo Code Example
    2. 10.2 Typical Applications
      1. 10.2.1 K-Type Thermocouple Measurement (–200°C to +1250°C)
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 3-Wire RTD Measurement (–200°C to +850°C)
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
          1. 10.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements
        3. 10.2.2.3 Application Curves
      3. 10.2.3 Resistive Bridge Measurement
        1. 10.2.3.1 Design Requirements
        2. 10.2.3.2 Detailed Design Procedure
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Sequencing
    2. 11.2 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 コミュニティ・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

10.2.2.2.1 Design Variations for 2-Wire and 4-Wire RTD Measurements

Implementing a 2- or 4-wire RTD measurement is very similar to the 3-wire RTD measurement illustrated in Figure 74, except that only one IDAC is required.

Figure 75 shows a typical circuit implementation of a 2-wire RTD measurement. The main difference compared to a 3-wire RTD measurement is with respect to the lead resistance compensation. The voltage drop across the lead resistors, RLEAD1 and RLEAD2, in this configuration is directly part of the measurement (as shown in Equation 27) because there is no means to compensate the lead resistance by use of the second current source. Any compensation must be done by calibration.

Equation 27. VIN = IIDAC1 · (RLEAD1 + RRTD + RLEAD2)
ADS112C04 ai_2W_RTD_example_bas894.gifFigure 75. 2-Wire RTD Measurement

Figure 76 shows a typical circuit implementation of a 4-wire RTD measurement. Similar to the 2-wire RTD measurement, only one IDAC is required for exciting and measuring a 4-wire RTD in a ratiometric manner. The main benefit of using a 4-wire RTD is that the ADC inputs are connected to the RTD in the form of a Kelvin connection. Apart from the input leakage currents of the ADC, there is no current flow through the lead resistors RLEAD2 and RLEAD3 and therefore no voltage drop is created across them. The voltage at the ADC inputs consequently equals the voltage across the RTD and the lead resistance is of no concern.

ADS112C04 ai_4W_RTD_example_bas894.gifFigure 76. 4-Wire RTD Measurement

As shown in Equation 28, the transfer function of a 2- and 4-wire RTD measurement differs compared to the one of a 3-wire RTD measurement by a factor of 2 because only one IDAC is used and only one IDAC flows through the reference resistor, RREF.

Equation 28. Code ∝ (RRTD (at Temperature) · Gain) / RREF

In addition, the input common-mode voltage and reference voltage is reduced compared to the 3-wire RTD configuration. Therefore, some further modifications may be required in case the 3-wire RTD design is used to measure 2- and 4-wire RTDs as well. If the decreased absolute input voltages does not meet the minimum absolute voltage requirements of the PGA anymore, either increase the value of RREF by switching in a larger resistor or, alternatively, increase the excitation current and decrease the gain at the same time.