JAJSFF5F September   2007  – October 2018 DAC5652A

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
    1.     機能ブロック図
  3. 3 概要
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics: DC
    6. 6.6  Electrical Characteristics: AC
    7. 6.7  Electrical Characteristics: Digital Input
    8. 6.8  Electrical Characteristics: Power Supply
    9. 6.9  Switching Characteristics
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Digital Inputs
      2. 7.3.2 References
        1. 7.3.2.1 Internal Reference
        2. 7.3.2.2 External Reference
    4. 7.4 Device Functional Modes
      1. 7.4.1 Input Interfaces
        1. 7.4.1.1 Dual-Bus Data Interface and Timing
        2. 7.4.1.2 Single-Bus Interleaved Data Interface and Timing
      2. 7.4.2 Gain Setting Option
      3. 7.4.3 Sleep Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 DAC Transfer Function
        1. 8.1.1.1 Analog Outputs
      2. 8.1.2 Output Configurations
      3. 8.1.3 Differential With Transformer
      4. 8.1.4 Single-Ended Configuration
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 ドキュメントのサポート
      1. 11.1.1 関連資料
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 コミュニティ・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

6.4 Thermal Information

THERMAL METRIC(1) DAC5652A UNIT
PFB (TQFP) RSL (VQFN)
48 PINS 48 PINS
RθJA Junction-to-ambient thermal resistance 65.3 27.0 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 16.4 17.3 °C/W
RθJB Junction-to-board thermal resistance 28.6 9.6 °C/W
ψJT Junction-to-top characterization parameter 0.4 0.2 °C/W
ψJB Junction-to-board characterization parameter 28.4 9.6 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A 2.2 °C/W
(1) For information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.