JAJSFG6A May   2018  – July 2019 LM26420-Q1

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      LM26420デュアル降圧DC/DCコンバータ
      2.      LM26420の効率(最高93%)
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions: 16-Pin WQFN
    2.     Pin Functions 20-Pin HTSSOP
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics Per Buck
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Soft Start
      2. 7.3.2 Power Good
      3. 7.3.3 Precision Enable
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Overvoltage Protection
      2. 7.4.2 Undervoltage Lockout
      3. 7.4.3 Current Limit
      4. 7.4.4 Thermal Shutdown
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Programming Output Voltage
      2. 8.1.2 VINC Filtering Components
      3. 8.1.3 Using Precision Enable and Power Good
      4. 8.1.4 Overcurrent Protection
    2. 8.2 Typical Applications
      1. 8.2.1 2.2-MHz, 0.8-V Typical High-Efficiency Application Circuit
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Custom Design With WEBENCH® Tools
          2. 8.2.1.2.2 Inductor Selection
          3. 8.2.1.2.3 Input Capacitor Selection
          4. 8.2.1.2.4 Output Capacitor
          5. 8.2.1.2.5 Calculating Efficiency and Junction Temperature
        3. 8.2.1.3 Application Curves
      2. 8.2.2 2.2-MHz, 1.8-V Typical High-Efficiency Application Circuit
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 LM26420-Q12.2-MHz, 2.5-V Typical High-Efficiency Application Circuit
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Method 1: Silicon Junction Temperature Determination
      2. 10.3.2 Thermal Shutdown Temperature Determination
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デベロッパー・ネットワークの製品に関する免責事項
      2. 11.1.2 WEBENCH®ツールによるカスタム設計
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

10.3.1 Method 1: Silicon Junction Temperature Determination

To accurately measure the silicon temperature for a given application, two methods can be used. The first method requires the user to know the thermal impedance of the silicon junction to top case temperature.

Some clarification needs to be made before we go any further.

RθJC is the thermal impedance from silicon junction to the exposed pad.

RθJT is the thermal impedance from top case to the silicon junction.

In this data sheet RθJT is used so that it allows the user to measure top case temperature with a small thermocouple attached to the top case.

RθJT is approximately 20°C/W for the 16-pin WQFN package with the exposed pad. Knowing the internal dissipation from the efficiency calculation given previously, and the case temperature, which can be empirically measured on the bench we have:

Equation 37. LM26420-Q1 TopCaseThermal.gif

Therefore:

Equation 38. TJ = (RθJT × PINTERNAL) + TC

From the previous example:

Equation 39. TJ = 20°C/W × 0.304W + TC