JAJSFW0F July   2018  – February 2021 CC1352P

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Functional Block Diagram
  5. 5 改訂履歴
  6. 6 Device Comparison
  7. 7 Terminal Configuration and Functions
    1. 7.1 Pin Diagram – RGZ Package (Top View)
    2. 7.2 Signal Descriptions – RGZ Package
    3. 7.3 Connections for Unused Pins and Modules
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Power Supply and Modules
    5. 8.5  Power Consumption - Power Modes
    6. 8.6  Power Consumption - Radio Modes
    7. 8.7  Nonvolatile (Flash) Memory Characteristics
    8. 8.8  Thermal Resistance Characteristics
    9. 8.9  RF Frequency Bands
    10. 8.10 861 MHz to 1054 MHz - Receive (RX)
    11. 8.11 861 MHz to 1054 MHz - Transmit (TX) 
    12. 8.12 861 MHz to 1054 MHz - PLL Phase Noise Wideband Mode
    13. 8.13 861 MHz to 1054 MHz - PLL Phase Noise Narrowband Mode
    14. 8.14 359 MHz to 527 MHz - Receive (RX)
    15. 8.15 359 MHz to 527 MHz - Transmit (TX) 
    16. 8.16 359 MHz to 527 MHz - PLL Phase Noise
    17. 8.17 143 MHz to 176 MHz - Receive (RX)
    18. 8.18 143 MHz to 176 MHz  - Transmit (TX) 
    19. 8.19 143 MHz to 176 MHz - PLL Phase Noise
    20. 8.20 Bluetooth Low Energy - Receive (RX)
    21. 8.21 Bluetooth Low Energy - Transmit (TX)
    22. 8.22 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - RX
    23. 8.23 Zigbee and Thread - IEEE 802.15.4-2006 2.4 GHz (OQPSK DSSS1:8, 250 kbps) - TX
    24. 8.24 Timing and Switching Characteristics
      1. 8.24.1 Reset Timing
      2. 8.24.2 Wakeup Timing
      3. 8.24.3 Clock Specifications
        1. 8.24.3.1 48 MHz Clock Input (TCXO)
        2. 8.24.3.2 48 MHz Crystal Oscillator (XOSC_HF)
        3. 8.24.3.3 48 MHz RC Oscillator (RCOSC_HF)
        4. 8.24.3.4 2 MHz RC Oscillator (RCOSC_MF)
        5. 8.24.3.5 32.768 kHz Crystal Oscillator (XOSC_LF)
        6. 8.24.3.6 32 kHz RC Oscillator (RCOSC_LF)
      4. 8.24.4 Synchronous Serial Interface (SSI) Characteristics
        1. 8.24.4.1 Synchronous Serial Interface (SSI) Characteristics
        2.       47
      5. 8.24.5 UART
        1. 8.24.5.1 UART Characteristics
    25. 8.25 Peripheral Characteristics
      1. 8.25.1 ADC
        1. 8.25.1.1 Analog-to-Digital Converter (ADC) Characteristics
      2. 8.25.2 DAC
        1. 8.25.2.1 Digital-to-Analog Converter (DAC) Characteristics
      3. 8.25.3 Temperature and Battery Monitor
        1. 8.25.3.1 Temperature Sensor
        2. 8.25.3.2 Battery Monitor
      4. 8.25.4 Comparators
        1. 8.25.4.1 Low-Power Clocked Comparator
        2. 8.25.4.2 Continuous Time Comparator
      5. 8.25.5 Current Source
        1. 8.25.5.1 Programmable Current Source
      6. 8.25.6 GPIO
        1. 8.25.6.1 GPIO DC Characteristics
    26. 8.26 Typical Characteristics
      1. 8.26.1 MCU Current
      2. 8.26.2 RX Current
      3. 8.26.3 TX Current
      4. 8.26.4 RX Performance
      5. 8.26.5 TX Performance
      6. 8.26.6 ADC Performance
  9. 9 Detailed Description
    1. 9.1  Overview
    2. 9.2  System CPU
    3. 9.3  Radio (RF Core)
      1. 9.3.1 Proprietary Radio Formats
      2. 9.3.2 Bluetooth 5.2 Low Energy
      3. 9.3.3 802.15.4 (Thread, Zigbee, 6LoWPAN)
    4. 9.4  Memory
    5. 9.5  Sensor Controller
    6. 9.6  Cryptography
    7. 9.7  Timers
    8. 9.8  Serial Peripherals and I/O
    9. 9.9  Battery and Temperature Monitor
    10. 9.10 µDMA
    11. 9.11 Debug
    12. 9.12 Power Management
    13. 9.13 Clock Systems
    14. 9.14 Network Processor
  10. 10Application, Implementation, and Layout
    1. 10.1 Reference Designs
  11. 11Device and Documentation Support
    1. 11.1 Device Nomenclature
    2. 11.2 Tools and Software
      1. 11.2.1 SimpleLink™ Microcontroller Platform
    3. 11.3 Documentation Support
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 用語集
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Packaging Information

8.15 359 MHz to 527 MHz - Transmit (TX) 

Measured on the LAUNCHXL-CC1352P-4 reference design with Tc = 25°C, VDDS = 3.6 V with DC/DC enabled and high power PA connected to VDDS unless otherwise noted.
All measurements are performed at the antenna input with a combined RX and TX path, except for high power PA which is measured at a dedicated antenna connection. All measurements are performed conducted. (1)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General parameters
Max output power,
Sub-1 GHz PA(2) 		433.92 MHz, without BOOST (VDDR = 1.7 V) 13 dBm
Output power programmable range
Sub-1 GHz PA 		433.92 MHz, without BOOST (VDDR = 1.7 V) 24 dB

Output power variation over temperature, Sub-1 GHz PA 		+13 dBm setting. 433.92 MHz
Over recommended temperature operating range		 ±1.5 dB
Spurious emissions and harmonics
Spurious emissions (excluding harmonics)
Sub-1 GHz PA, 433.92 MHz (3) 		30 MHz to 1 GHz +10 dBm setting
ETSI restricted bands		 < -54 dBm
+10 dBm setting
ETSI outside restricted bands		 < -36 dBm
1 GHz to 12.75 GHz
(outside ETSI restricted bands)		 +10 dBm setting
measured in 1 MHz bandwidth (ETSI)		 < -30 dBm
Spurious emissions out-of-band
Sub-1 GHz PA, 429 MHz (3) 		Outside the necessary requency band
(ARIB T-67)		 +10 dBm setting < -26 dBm
710 MHz to 900 MHz
(ARIB T-67)		 +10 dBm setting < -55 dBm
900 MHz to 915 MHz
(ARIB T-67)		 +10 dBm setting < -55 dBm
930 MHz to 1000 MHz
(ARIB T-67)		 +10 dBm setting < -55 dBm
1000 MHz to 1215 MHz
(ARIB T-67)		 +10 dBm setting < -45 dBm
Above 1215 MHz
(ARIB T-67)		 +10 dBm setting < -30 dBm
Harmonics
Sub-1 GHz PA 		Second harmonic +13 dBm setting, 433 MHz < -36 dBm
Harmonics
Sub-1 GHz PA 		Third harmonic +13 dBm setting, 433 MHz < -30 dBm
Harmonics
Sub-1 GHz PA 		Fourth harmonic +13 dBm setting, 433 MHz < -30 dBm
Harmonics
Sub-1 GHz PA 		Fifth harmonic +13 dBm setting, 433 MHz < -30 dBm
(1) Some combinations of frequency, data rate and modulation format requires use of external crystal load capacitors for regulatory compliance. More details can be found in the device errata.
(2) Output power is dependent on RF match. For dual-band devices in the CC13x2 platform, output power might be slightly reduced depending on RF layout trade-offs.
(3) Suitable for systems targeting compliance with EN 300 220, EN 303 131, EN 303 204, FCC CFR47 Part 15, ARIB STD-T108.