JAJSG06E April   2016  – October 2018 LMG3410R070 , LMG3411R070

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      ブロック概略図
      2.      100V/nsを超えるスイッチング性能
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Switching Parameters
      1. 8.1.1 Turn-on Delays
      2. 8.1.2 Turn-off Delays
      3. 8.1.3 Drain Slew Rate
      4. 8.1.4 Turn-on and Turn-off Energy
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Direct-Drive GaN Architecture
      2. 9.3.2 Internal Buck-Boost DC-DC Converter
      3. 9.3.3 Internal Auxiliary LDO
      4. 9.3.4 Fault Detection
        1. 9.3.4.1 Over-current Protection
        2. 9.3.4.2 Over-Temperature Protection and UVLO
      5. 9.3.5 Drive Strength Adjustment
    4. 9.4 Device Functional Modes
      1. 9.4.1 Low-Power Mode
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Slew Rate Selection
          1. 10.2.2.1.1 Startup and Slew Rate with Bootstrap High-Side Supply
        2. 10.2.2.2 Signal Level-Shifting
        3. 10.2.2.3 Buck-Boost Converter Design
      3. 10.2.3 Application Curves
    3. 10.3 Paralleling GaN Devices
    4. 10.4 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Using an Isolated Power Supply
    2. 11.2 Using a Bootstrap Diode
      1. 11.2.1 Diode Selection
      2. 11.2.2 Managing the Bootstrap Voltage
      3. 11.2.3 Reliable Bootstrap Start-up
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Power Loop Inductance
      2. 12.1.2 Signal Ground Connection
      3. 12.1.3 Bypass Capacitors
      4. 12.1.4 Switch-Node Capacitance
      5. 12.1.5 Signal Integrity
      6. 12.1.6 High-Voltage Spacing
      7. 12.1.7 Thermal Recommendations
    2. 12.2 Layout Example
  13. 13デバイスおよびドキュメントのサポート
    1. 13.1 デバイス・サポート
      1. 13.1.1 デベロッパー・ネットワークの製品に関する免責事項
    2. 13.2 ドキュメントのサポート
      1. 13.2.1 関連資料
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 コミュニティ・リソース
    5. 13.5 商標
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 Glossary
  14. 14メカニカル、パッケージ、および注文情報

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
MIN MAX UNIT
V DS Drain-Source Voltage 600 V
VDS,tr(2) Transient Drain-Source Voltage 800 V
V DD Supply Voltage –0.3 20 V
I DS,pul(3) Drain-Source Current, Pulsed 100 A
IDS(4) Continous drain current @Tj=25℃ 40
Continous drain current @Tj=100℃ 30 A
V IN IN, LPM Pin Voltage -0.3 5.5 V
V FAULT FAULT Pin Voltage –0.3 5.5 V
T STG Storage Temperature –55 150 °C
T J Operating Temperature –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) <1% duty cycle, <1us, for 1M pulses