JAJSGQ5A December   2018  – December 2021 OPT3004

PRODMIX  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 概要 (続き)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Human Eye Matching
      2. 8.3.2 Automatic Full-Scale Range Setting
      3. 8.3.3 Interrupt Operation, INT Pin, and Interrupt Reporting Mechanisms
      4. 8.3.4 I2C Bus Overview
        1. 8.3.4.1 Serial Bus Address
        2. 8.3.4.2 Serial Interface
    4. 8.4 Device Functional Modes
      1. 8.4.1 Automatic Full-Scale Setting Mode
      2. 8.4.2 Interrupt Reporting Mechanism Modes
        1. 8.4.2.1 Latched Window-Style Comparison Mode
        2. 8.4.2.2 Transparent Hysteresis-Style Comparison Mode
        3. 8.4.2.3 End-of-Conversion Mode
        4. 8.4.2.4 End-of-Conversion and Transparent Hysteresis-Style Comparison Mode
    5. 8.5 Programming
      1. 8.5.1 Writing and Reading
        1. 8.5.1.1 High-Speed I2C Mode
        2. 8.5.1.2 General-Call Reset Command
        3. 8.5.1.3 SMBus Alert Response
    6. 8.6 Register Maps
      1. 8.6.1 Internal Registers
      2. 8.6.2 Register Descriptions
        1. 8.6.2.1 Result Register (offset = 00h)
        2. 8.6.2.2 Configuration Register (offset = 01h) [reset = C810h]
        3. 8.6.2.3 Low-Limit Register (offset = 02h) [reset = C0000h]
        4. 8.6.2.4 High-Limit Register (offset = 03h) [reset = BFFFh]
        5. 8.6.2.5 Manufacturer ID Register (offset = 7Eh) [reset = 5449h]
        6. 8.6.2.6 Device ID Register (offset = 7Fh) [reset = 3001h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Electrical Interface
      2. 9.1.2 Optical Interface
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Optomechanical Design
        2. 9.2.2.2 Dark Window Selection and Compensation
      3. 9.2.3 Application Curves
    3. 9.3 Do's and Don'ts
  10. 10Power-Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Soldering and Handling Recommendations
    4. 11.4 DNP (S-PDSO-N6) Mechanical Drawings
    5. 11.5 DTS (SOT-5X3) Mechanical Drawings
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 サポート・リソース
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

11.1 Layout Guidelines

The PCB layout design for the OPT3004 requires a couple of considerations. Bypass the power supply with a capacitor placed close to the OPT3004. Note that optically reflective surfaces of components also affect the performance of the design. The three-dimensional geometry of all components and structures around the sensor must be taken into consideration to prevent unexpected results from secondary optical reflections. Placing capacitors and components at a distance of at least twice the height of the component is usually sufficient. The most optimal optical layout is to place all close components on the opposite side of the PCB from the OPT3004. However, this approach may not be practical for the constraints of every design.

Electrically connecting the thermal pad to ground is recommended. This connection can be created either with a PCB trace or with vias to ground directly on the thermal pad itself. If the thermal pad contains vias, they are recommended to be of a small diameter (< 0.2 mm) to prevent them from wicking the solder away from the appropriate surfaces.

An example PCB layout with the OPT3004 is shown in Figure 11-1.