JAJSH03B May   2013  – February 2019 ADS8860

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      ADC 電源用に別個の LDO が不要
  4. 4 改訂履歴
  5. 5 概要（続き）
  6. 6 Device Comparison Table
  7. 7 Pin Configuration and Functions
    1.     Pin Functions
  8. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements: 3-Wire Operation
    7. 8.7 Timing Requirements: 4-Wire Operation
    8. 8.8 Timing Requirements: Daisy-Chain
    9. 8.9 Typical Characteristics
  9. 9 Parameter Measurement Information
    1. 9.1 Equivalent Circuits
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Analog Input
      2. 10.3.2 Reference
      3. 10.3.3 Clock
      4. 10.3.4 ADC Transfer Function
    4. 10.4 Device Functional Modes
      1. 10.4.1 CS Mode
        1. 10.4.1.1 3-Wire CS Mode Without a Busy Indicator
        2. 10.4.1.2 3-Wire CS Mode With a Busy Indicator
        3. 10.4.1.3 4-Wire CS Mode Without a Busy Indicator
        4. 10.4.1.4 4-Wire CS Mode With a Busy Indicator
      2. 10.4.2 Daisy-Chain Mode
        1. 10.4.2.1 Daisy-Chain Mode Without a Busy Indicator
        2. 10.4.2.2 Daisy-Chain Mode With a Busy Indicator
  11. 11Application and Implementation
    1. 11.1 Application Information
      1. 11.1.1 ADC Reference Driver
      2. 11.1.2 ADC Input Driver
        1. 11.1.2.1 Input Amplifier Selection
        2. 11.1.2.2 Charge-Kickback Filter
    2. 11.2 Typical Applications
      1. 11.2.1 DAQ Circuit for a 1-µs, Full-Scale Step Response
        1. 11.2.1.1 Design Requirements
        2. 11.2.1.2 Detailed Design Procedure
      2. 11.2.2 DAQ Circuit for Lowest Distortion and Noise Performance at 1 MSPS
        1. 11.2.2.1 Design Requirements
        2. 11.2.2.2 Detailed Design Procedure
      3. 11.2.3 Ultralow-Power DAQ Circuit at 10 kSPS
        1. 11.2.3.1 Design Requirements
        2. 11.2.3.2 Detailed Design Procedure
  12. 12Power Supply Recommendations
    1. 12.1 Power-Supply Decoupling
    2. 12.2 Power Saving
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14デバイスおよびドキュメントのサポート
    1. 14.1 ドキュメントのサポート
      1. 14.1.1 関連資料
    2. 14.2 ドキュメントの更新通知を受け取る方法
    3. 14.3 コミュニティ・リソース
    4. 14.4 商標
    5. 14.5 静電気放電に関する注意事項
    6. 14.6 Glossary
  15. 15メカニカル、パッケージ、および注文情報

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
AINP to GND or AINN to GND –0.3 REF + 0.3 V
AVDD to GND or DVDD to GND –0.3 4 V
REF to GND –0.3 5.7 V
Digital input voltage to GND –0.3 DVDD + 0.3 V
Digital output to GND –0.3 DVDD + 0.3 V
Input current to any pin except supply pins –10 10 mA
Operating temperature, TA –40 85 °C
Storage temperature, Tstg –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.