JAJSH08B
November 2014 – August 2019
DS90UB949-Q1
PRODUCTION DATA.
1
特長
2
アプリケーション
3
概要
Device Images
アプリケーション図
4
改訂履歴
5
概要(続き)
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
DC Electrical Characteristics
7.6
AC Electrical Characteristics
7.7
DC And AC Serial Control Bus Characteristics
7.8
Recommended Timing for the Serial Control Bus
7.9
Timing Diagrams
7.10
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
High-Definition Multimedia Interface (HDMI)
8.3.1.1
HDMI Receive Controller
8.3.2
Transition Minimized Differential Signaling
8.3.3
Enhanced Display Data Channel
8.3.4
Extended Display Identification Data (EDID)
8.3.4.1
External Local EDID (EEPROM)
8.3.4.2
Internal EDID (SRAM)
8.3.4.3
External Remote EDID
8.3.4.4
Internal Pre-Programmed EDID
8.3.5
Consumer Electronics Control (CEC)
8.3.6
+5-V Power Signal
8.3.7
Hot Plug Detect (HPD)
8.3.8
High-Speed Forward Channel Data Transfer
8.3.9
Back Channel Data Transfer
8.3.10
FPD-Link III Port Register Access
8.3.11
Power Down (PDB)
8.3.12
Serial Link Fault Detect
8.3.13
Interrupt Pin (INTB)
8.3.14
Remote Interrupt Pin (REM_INTB)
8.3.15
General-Purpose I/O
8.3.15.1
GPIO[3:0] and D_GPIO[3:0] Configuration
8.3.15.2
Back Channel Configuration
8.3.15.3
GPIO_REG[8:5] Configuration
8.3.16
SPI Communication
8.3.16.1
SPI Mode Configuration
8.3.16.2
Forward Channel SPI Operation
8.3.16.3
Reverse Channel SPI Operation
8.3.17
Backward Compatibility
8.3.18
Audio Modes
8.3.18.1
HDMI Audio
8.3.18.2
DVI I2S Audio Interface
8.3.18.2.1
I2S Transport Modes
8.3.18.2.2
I2S Repeater
8.3.18.3
AUX Audio Channel
8.3.18.4
TDM Audio Interface
8.3.19
Built-In Self Test (BIST)
8.3.19.1
BIST Configuration And Status
8.3.19.2
Forward Channel and Back Channel Error Checking
8.3.20
Internal Pattern Generation
8.3.20.1
Pattern Options
8.3.20.2
Color Modes
8.3.20.3
Video Timing Modes
8.3.20.4
External Timing
8.3.20.5
Pattern Inversion
8.3.20.6
Auto Scrolling
8.3.20.7
Additional Features
8.3.21
Spread Spectrum Clock Tolerance
8.4
Device Functional Modes
8.4.1
Mode Select Configuration Settings (MODE_SEL[1:0])
8.4.2
FPD-Link III Modes of Operation
8.4.2.1
Single Link Operation
8.4.2.2
Dual Link Operation
8.4.2.3
Replicate Mode
8.4.2.4
Auto-Detection of FPD-Link III Modes
8.4.3
Frequency Detection Circuit May Reset the FPD-Link III PLL During a Temperature Ramp
8.5
Programming
8.5.1
Serial Control Bus
8.5.2
Multi-Master Arbitration Support
8.5.3
I2C Restrictions on Multi-Master Operation
8.5.4
Multi-Master Access to Device Registers for Newer FPD-Link III Devices
8.5.5
Multi-Master Access to Device Registers for Older FPD-Link III Devices
8.5.6
Restrictions on Control Channel Direction for Multi-Master Operation
8.6
Register Maps
9
Application and Implementation
9.1
Applications Information
9.2
Typical Applications
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.2.1
High-Speed Interconnect Guidelines
9.2.3
Application Curves
9.2.3.1
Application Performance Plots
10
Power Supply Recommendations
10.1
Power-Up Requirements and PDB Pin
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
デバイスおよびドキュメントのサポート
12.1
ドキュメントのサポート
12.1.1
関連資料
12.2
ドキュメントの更新通知を受け取る方法
12.3
商標
12.4
静電気放電に関する注意事項
12.5
Glossary
13
メカニカル、パッケージ、および注文情報
7.10
Typical Characteristics
Figure 8.
Serializer Output at 2.975 Gbps (85-MHz
TMDS
Clock)
Figure 9.
Serializer Output at 3.36 Gbps (96-MHz
TMDS
Clock)