JAJSHF6A May   2019  – August 2020 TMP390

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 TMP390 Programming Tables
      2. 7.3.2 Trip Test
      3. 7.3.3 20°C Hysteresis
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Applications Information
    2. 8.2 Typical Applications
      1. 8.2.1 Simplified Application Schematic
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
      2. 8.2.2 TMP390 With 10°C Hysteresis
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 One Channel Operation for Hot Trip Point up to 124°C
        1. 8.2.3.1 Application Curve
      4. 8.2.4 One Channel Operation for Cold Trip Point
        1. 8.2.4.1 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 ドキュメントの更新通知を受け取る方法
    2. 11.2 サポート・リソース
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 用語集
  12. 12Mechanical, Packaging, and Orderable Information

7.3.2 Trip Test

The purpose of the trip test is in system manufacturing test without putting the TMP390 through costly temperature verification of the assembly of TMP390 and pullup resistors. When the SETA or SETB pin is set to a high logic level, the associated output goes low. When the input pin level goes low, the output goes to its previous condition before the trip test. The trip test does not affect the current condition of the device. The trip test signals should stay above 0.8 × VDD for logic high and below 0.2 × VDD for logic low.

The trip test operation is shown in Figure 7-2. The trip test must be performed with a single toggle when the device is operating at a temperature that will not cause the corresponding output to trip. The trip test is intended for production testing after assembly, and must not be used as a functional feature.

GUID-A77AB79F-5036-44DF-8FEC-0AC627ACAFB4-low.gifFigure 7-2 TMP390 Trip Test Operation