JAJSHR4B August   2019  – April 2020 AMC1336

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      概略回路図
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. Table 1.  Absolute Maximum Ratings
    2. Table 2.  ESD Ratings
    3. Table 3.  Recommended Operating Conditions
    4. Table 4.  Thermal Information
    5. Table 5.  Power Ratings
    6. Table 6.  Insulation Specifications
    7. Table 7.  Safety-Related Certifications
    8. Table 8.  Safety Limiting Values
    9. Table 9.  Electrical Characteristics
    10. Table 10. Switching Characteristics
    11. 6.1       Insulation Characteristics Curves
    12. 6.2       Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 Modulator
      3. 7.3.3 Isolation Channel Signal Transmission
      4. 7.3.4 Clock Input
      5. 7.3.5 Digital Output
    4. 7.4 Device Functional Modes
      1. 7.4.1 Output Behavior in Case of a Full-Scale Input
      2. 7.4.2 AVDD Diagnostics and Fail-Safe Output
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Digital Filter Usage
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
      4. 8.2.4 What to Do and What Not to Do
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デバイスの項目表記
        1. 11.1.1.1 絶縁の用語集
    2. 11.2 ドキュメントのサポート
      1. 11.2.1 関連資料
    3. 11.3 ドキュメントの更新通知を受け取る方法
    4. 11.4 コミュニティ・リソース
    5. 11.5 商標
    6. 11.6 静電気放電に関する注意事項
    7. 11.7 Glossary
  12. 12メカニカル、パッケージ、および注文情報

Table 4. Thermal Information

THERMAL METRIC(1) AMC1336 UNIT
DWV (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 94 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 36 °C/W
RθJB Junction-to-board thermal resistance 46.1 °C/W
ψJT Junction-to-top characterization parameter 11.5 °C/W
ψJB Junction-to-board characterization parameter 44.4 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.