JAJSHU7D August   2019  – April 2021 THS6222

PRODUCTION DATA  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = 12 V
    6. 6.6 Electrical Characteristics: VS = 32 V
    7. 6.7 Timing Requirements
    8. 6.8 Typical Characteristics: VS = 12 V
    9. 6.9 Typical Characteristics: VS = 32 V
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Common-Mode Buffer
      2. 7.3.2 Thermal Protection and Package Power Dissipation
      3. 7.3.3 Output Voltage and Current Drive
      4. 7.3.4 Breakdown Supply Voltage
      5. 7.3.5 Surge Test Results
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Broadband PLC Line Driving
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 What to Do and What Not to Do
      1. 8.3.1 Do
      2. 8.3.2 Do Not
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Wafer and Die Information
    3. 10.3 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 サポート・リソース
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

4 Revision History

Changes from Revision C (November 2020) to Revision D (April 2021)

  • Corrected the wrong pin diagram image that was tagged incorrectly during system migrationGo

Changes from Revision B (April 2020) to Revision C (November 2020)

  • 文書全体にわたって表、図、相互参照の採番方法を更新Go
  • 「製品情報」表に VQFN (16) パッケージを追加Go
  • Updated the RHF package in the Pin Configuration and Functions sectionGo
  • Added the RGT package in the Pin Configuration and Functions sectionGo

Changes from Revision A (December 2019) to Revision B (April 2020)

  • 「製品情報」表にウェハー販売パッケージとボディ・サイズ（公称）を追加Go
  • Added the YS Die bondpad and functionsGo
  • Updated Table 1 BIAS-1 and BIAS-2 Logic TableGo
  • Added Wafer and Die Information sectionGo

Changes from Revision * (August 2019) to Revision A (December 2019)

  • デバイス・ステータスを「事前情報」から「量産データ」に変更Go