JAJSI89B December   2019  – April 2020 TLV751

PRODUCTION DATA.  

  1. 1 特長
  2. 2 アプリケーション
  3. 3 概要
    1.     Device Images
      1.      代表的なアプリケーション
  4. 4 改訂履歴
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Undervoltage Lockout (UVLO)
      2. 7.3.2 Shutdown
      3. 7.3.3 Foldback Current Limit
      4. 7.3.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Feed-Forward Capacitor (CFF)
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curve
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11デバイスおよびドキュメントのサポート
    1. 11.1 デバイス・サポート
      1. 11.1.1 デバイスの項目表記
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 商標
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 Glossary
  12. 12メカニカル、パッケージ、および注文情報

5 Pin Configuration and Functions

DSQ Package
10-Pin Adjustable WSON
Top View
DSQ Package
10-Pin Fixed WSON
Top View

Pin Functions

PIN I/O DESCRIPTION
NAME DSQ (Adjustable) DSQ (Fixed)
EN1 3 3 Input Enable pin. Drive EN1 greater than VEN1(HI) to turn on the regulator.
Drive EN1 less than VEN1(LO) to put the low-dropout (LDO) regulator into shutdown mode.
EN2 5 5 Input Enable pin. Drive EN2 greater than VEN2(HI) to turn on the regulator.
Drive EN2 less than VEN2(LO) to put the LDO into shutdown mode.
FB1 1 — — For the adjustable version, this pin is used as an input to the control loop error amplifier and is used to set the output voltage of the LDO.
FB2 7 — — For the adjustable version, this pin is used as an input to the control loop error amplifier and is used to set the output voltage of the LDO.
GND 2, 4 2, 4 — Ground pin
IN1 9 9 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the input capacitor as close to the output of the device as possible.
IN2 6 6 Input Input pin. For best transient response and to minimize input impedance, use the recommended value or larger ceramic capacitor from IN to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the input capacitor as close to the output of the device as possible.
NC — 1, 7 — For the fixed version, this pin is not connected internally.
OUT1 10 10 Output Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the output capacitor as close to output of the device as possible.
OUT2 8 8 Output Regulated output voltage pin. A capacitor is required from OUT to ground for stability. For best transient response, use the nominal recommended value or larger ceramic capacitor from OUT to ground; see the Recommended Operating Conditions table and the Input and Output Capacitor Selection section. Place the output capacitor as close to output of the device as possible.
Thermal pad — Connect the thermal pad to a large area GND plane for improved thermal performance.