THERMAL METRICS(1) |
°C/W(2)(3) |
RΘJC |
Junction-to-case |
4.92 |
RΘJB |
Junction-to-board |
6.57 |
RΘJA |
Junction-to-free air |
22.3 |
RΘJMA |
Junction-to-moving air |
N/A(4) |
PsiJT |
Junction-to-package top |
4.92 |
PsiJB |
Junction-to-board |
6.4 |
(2) °C/W = degrees Celsius per watt.
(3) These values are based on a JEDEC-defined 2S2P system (with the
exception of the Theta JC [RΘ
JC] value, which is based on a
JEDEC-defined 1S0P system) and will change based on environment as well as
application. For more information, see these EIA/JEDEC standards:
- JESD51-2, Integrated
Circuits Thermal Test Method Environmental Conditions - Natural
Convection (Still Air)
- JESD51-3, Low
Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages
- JESD51-7, High
Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages
- JESD51-9, Test Boards
for Area Array Surface Mount Package Thermal Measurements
(4) N/A = not applicable