JAJSKH4A April   2022  – May 2024 TUSB1104

PRODUCTION DATA  

  1.   1
  2. 特長
  3. アプリケーション
  4.   概要
  5. Pin Configuration and Functions
  6. Specifications
    1. 4.1  Absolute Maximum Ratings
    2. 4.2  ESD Ratings
    3. 4.3  Recommended Operating Conditions
    4. 4.4  Thermal Information
    5. 4.5  Power Supply Characteristics
    6. 4.6  Control I/O DC Electrical Characteristics
    7. 4.7  USB Electrical Characteristics
    8. 4.8  Timing Requirements
    9. 4.9  Switching Characteristics
    10. 4.10 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 4-Level Inputs
      2. 6.3.2 USB Receiver Linear Equalization
        1. 6.3.2.1 Linear EQ Configuration
        2. 6.3.2.2 Full Adaptive Equalization
        3. 6.3.2.3 Fast Adaptive Equalization
      3. 6.3.3 USB Transmitter
        1. 6.3.3.1 Linearity VOD
        2. 6.3.3.2 Limited VOD
        3. 6.3.3.3 Transmit Equalization (Limited Redriver Mode Only)
      4. 6.3.4 USB 3.2 x2 Description
      5. 6.3.5 USB Polarity Inversion
      6. 6.3.6 Receiver Detect Control
    4. 6.4 Device Functional Modes
      1. 6.4.1 MODE Pin
      2. 6.4.2 Rx EQ Configuration in Pin-Strap Mode
      3. 6.4.3 USB 3.2 Power States
      4. 6.4.4 Disabling U1 and U2
    5. 6.5 Programming
      1. 6.5.1 Pseudocode Examples
        1. 6.5.1.1 Fixed EQ with Linear Redriver Mode
        2. 6.5.1.2 Fixed EQ with Limited Redriver Mode
        3. 6.5.1.3 Fast AEQ with Linear Redriver Mode
        4. 6.5.1.4 Fast AEQ with Limited Redriver Mode
        5. 6.5.1.5 Full AEQ with Linear Redriver Mode
        6. 6.5.1.6 Full AEQ with Limited Redriver Mode
      2. 6.5.2 TUSB1104 I2C Address Options
      3. 6.5.3 TUSB1104 I2C Target Behavior
    6. 6.6 Register Map
      1. 6.6.1 Device Registers
  9. Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 USB SSTX1/2 Receiver Configuration
        2. 7.2.2.2 USB CRX1/2 Receiver Configuration
          1. 7.2.2.2.1 Fixed Equalization
          2. 7.2.2.2.2 Full Adaptive Equalization
          3. 7.2.2.2.3 Fast Adaptive Equalization
        3. 7.2.2.3 ESD Protection
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  10. Device and Documentation Support
    1. 8.1 ドキュメントの更新通知を受け取る方法
    2. 8.2 サポート・リソース
    3. 8.3 Trademarks
    4. 8.4 静電気放電に関する注意事項
    5. 8.5 用語集
  11. Revision History
  12. 10Mechanical, Packaging, and Orderable Information

Layout Guidelines

  1. SSTX1P/N, SSRX1P/N, SSTX2P/N, SSRX2P/N, CRX1P/N, CRX2PN, CTX1P/N, and CTX2P/N pairs should be routed with controlled 90-Ω differential impedance (±10%).
  2. Keep away from other high speed signals.
  3. Intra-pair routing (between P and N) should be kept to less than 5 mils.
  4. Length matching should be near the location of mismatch.
  5. Each pair should be separated at least by 3 times the signal trace width.
  6. The use of bends in differential traces should be kept to a minimum. When bends are used, the number of left and right bends should be as equal as possible and the angle of the bend should be ≥ 135 degrees. This will minimize any length mismatch caused by the bends and therefore minimize the impact bends have on EMI.
  7. Route all differential pairs on the same of layer.
  8. The number of vias should be kept to a minimum. It is recommended to keep the vias count to 2 or less.
  9. Keep traces on layers adjacent to ground plane.
  10. Do not route differential pairs over any plane split.
  11. Adding test points will cause impedance discontinuity, and therefore, negatively impact signal performance. If test points are used, they should be placed in series and symmetrically. They must not be placed in a manner that causes a stub on the differential pair.
  12. Highly recommended to have reference plane void under USB-C receptacle's super speed pins to minimize the capacitance effect of the receptacle.
  13. Highly recommended to have reference plane void under the AC-coupling capacitances.