JAJSM11 may   2021 BQ25720

PRODUCTION DATA  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information
    5. 8.5 Electrical Characteristics
    6. 8.6 Timing Requirements
    7. 8.7 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Power-Up Sequence
      2. 9.3.2  Vmin Active Protection (VAP) with Battery only
      3. 9.3.3  Two-Level Battery Discharge Current Limit
      4. 9.3.4  Fast Role Swap Feature
      5. 9.3.5  CHRG_OK Indicator
      6. 9.3.6  Input and Charge Current Sensing
      7. 9.3.7  Input Voltage and Current Limit Setup
      8. 9.3.8  Battery Cell Configuration
      9. 9.3.9  Device HIZ State
      10. 9.3.10 USB On-The-Go (OTG)
      11. 9.3.11 Converter Operation
      12. 9.3.12 Inductance Detection Through IADPT Pin
      13. 9.3.13 Converter Compensation
      14. 9.3.14 Continuous Conduction Mode (CCM)
      15. 9.3.15 Pulse Frequency Modulation (PFM)
      16. 9.3.16 Switching Frequency and Dithering Feature
      17. 9.3.17 Current and Power Monitor
        1. 9.3.17.1 High-Accuracy Current Sense Amplifier (IADPT and IBAT)
        2. 9.3.17.2 High-Accuracy Power Sense Amplifier (PSYS)
      18. 9.3.18 Input Source Dynamic Power Management
      19. 9.3.19 Input Current Optimizer (ICO)
      20. 9.3.20 Two-Level Adapter Current Limit (Peak Power Mode)
      21. 9.3.21 Processor Hot Indication
        1. 9.3.21.1 PROCHOT During Low Power Mode
        2. 9.3.21.2 PROCHOT Status
      22. 9.3.22 Device Protection
        1. 9.3.22.1 Watchdog Timer
        2. 9.3.22.2 Input Overvoltage Protection (ACOV)
        3. 9.3.22.3 Input Overcurrent Protection (ACOC)
        4. 9.3.22.4 System Overvoltage Protection (SYSOVP)
        5. 9.3.22.5 Battery Overvoltage Protection (BATOVP)
        6. 9.3.22.6 Battery Discharge Overcurrent Protection (BATOC)
        7. 9.3.22.7 Battery Short Protection (BATSP)
        8. 9.3.22.8 System Undervoltage Lockout (VSYS_UVP) and Hiccup Mode
        9. 9.3.22.9 Thermal Shutdown (TSHUT)
    4. 9.4 Device Functional Modes
      1. 9.4.1 Forward Mode
        1. 9.4.1.1 System Voltage Regulation with Narrow VDC Architecture
        2. 9.4.1.2 Battery Charging
      2. 9.4.2 USB On-The-Go
      3. 9.4.3 Pass Through Mode (PTM)-Patented Technology
    5. 9.5 Programming
      1. 9.5.1 SMBus Interface
        1. 9.5.1.1 SMBus Write-Word and Read-Word Protocols
        2. 9.5.1.2 Timing Diagrams
    6. 9.6 Register Map
      1. 9.6.1  ChargeOption0 Register (SMBus address = 12h) [reset = E70Eh]
      2. 9.6.2  ChargeCurrent Register (SMBus address = 14h) [reset = 0000h]
        1. 9.6.2.1 Battery Pre-Charge Current Clamp
      3. 9.6.3  ChargeVoltage Register (SMBus address = 15h) [reset value based on CELL_BATPRESZ pin setting]
      4. 9.6.4  ChargerStatus Register (SMBus address = 20h) [reset = 0000h]
      5. 9.6.5  ProchotStatus Register (SMBus address = 21h) [reset = B800h]
      6. 9.6.6  IIN_DPM Register With 10-mΩ Sense Resistor (SMBus address = 22h) [reset = 4100h]
      7. 9.6.7  ADCVBUS/PSYS Register (SMBus address = 23h)
      8. 9.6.8  ADCIBAT Register (SMBus address = 24h)
      9. 9.6.9  ADCIINCMPIN Register (SMBus address = 25h)
      10. 9.6.10 ADCVSYSVBAT Register (SMBus address = 26h)
      11. 9.6.11 ChargeOption1 Register (SMBus address = 30h) [reset = 3300h]
      12. 9.6.12 ChargeOption2 Register (SMBus address = 31h) [reset = 00B7]
      13. 9.6.13 ChargeOption3 Register (SMBus address = 32h) [reset = 0434h]
      14. 9.6.14 ProchotOption0 Register (SMBus address = 33h) [reset = 4A81h(2S~) 4A09(1S)]
      15. 9.6.15 ProchotOption1 Register (SMBus address = 34h) [reset = 41A0h]
      16. 9.6.16 ADCOption Register (SMBus address = 35h) [reset = 2000h]
      17. 9.6.17 ChargeOption4 Register (SMBus address = 36h) [reset = 0048h]
      18. 9.6.18 Vmin Active Protection Register (SMBus address = 37h) [reset = 006Ch(2s~4s)/0004h(1s)]
      19. 9.6.19 OTGVoltage Register (SMBus address = 3Bh) [reset = 09C4h]
      20. 9.6.20 OTGCurrent Register (SMBus address = 3Ch) [reset = 3C00h]
      21. 9.6.21 InputVoltage (VINDPM) Register (SMBus address = 3Dh) [reset = VBUS-1.28V]
      22. 9.6.22 VSYS_MIN Register (SMBus address = 3Eh) [reset value based on CELL_BATPRESZ pin setting]
      23. 9.6.23 IIN_HOST Register (SMBus address = 3Fh) [reset = 4100h]
      24. 9.6.24 ID Registers
        1. 9.6.24.1 ManufactureID Register (SMBus address = FEh) [reset = 0040h]
        2. 9.6.24.2 Device ID (DeviceAddress) Register (SMBus address = FFh) [reset = 00E1h]
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 ACP-ACN Input Filter
        2. 10.2.2.2 Inductor Selection
        3. 10.2.2.3 Input Capacitor
        4. 10.2.2.4 Output Capacitor
        5. 10.2.2.5 Power MOSFETs Selection
      3. 10.2.3 Application Curves
  12. 11Power Supply Recommendations
  13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
      1. 12.2.1 Layout Example Reference Top View
      2. 12.2.2 Inner Layer Layout and Routing Example
  14. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 サード・パーティ製品に関する免責事項
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 サポート・リソース
    5. 13.5 Trademarks
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 用語集
  15. 14Mechanical, Packaging, and Orderable Information

10.2.2.4 Output Capacitor

Output capacitor also should have enough ripple current rating to absorb output switching ripple current. To get good loop stability, the resonant frequency of the output inductor and output capacitor should be designed between 10 kHz and 20 kHz. The preferred ceramic capacitor is 25-V X7R or X5R for output capacitor. Minimum 7 pcs of 10-μF 0603 package capacitor is suggested to be placed as close as possible to Q3&Q4 half bridge (between Q4 drain and Q3 source terminal). Total minimum output effective capacitance along VSYS distribution line is 50 μF refers to Table 10-2. Recommend to place minimum 20-μF MLCC capacitors after the charge current sense resistor for best stability.

Ceramic capacitors show a dc-bias effect. This effect reduces the effective capacitance when a dc-bias voltage is applied across a ceramic capacitor, as on the output capacitor of a charger. The effect may lead to a significant capacitance drop, especially for high output voltages and small capacitor packages. See the manufacturer's data sheet about the derating performance with a dc bias voltage applied. It may be necessary to choose a higher voltage rating or nominal capacitance value in order to get the required capacitance value at the operating point. Considering the 25-V 0603 package MLCC capacitance derating under 21-V to 23-V output voltage, the recommended practical capacitors configuration at VSYS output terminal can also be found in Table 10-2. Tantalum capacitors (POSCAP) can avoid dc-bias effect and temperature variation effect which are recommend to be used along VSYS output distribution line to meet total minimum effective output capacitance requirement.

Table 10-2 Minimum Output Capacitance Requirement
OUTPUT CAPACITORS vs TOTAL INPUT POWER 65 W 90 W 130 W
Minimum Effective Output Capacitance 50 μF 50 μF 50 μF
Minimum output capacitors at charger VSYS output terminal 7*10 μF (0603 25 V MLCC) 9*10 μF (0603 25 V MLCC) 9*10 μF (0603 25 V MLCC)
Additional output capacitors along VSYS distribution line 2*22 μF (25 V~35 V POSCAP) 2*22 μF (25 V~35 V POSCAP) 2*22 μF (25 V~35 V POSCAP)