For related documentation see the following:
- Texas Instruments, Thermal Design
by Insight not Hindsight application report
- Texas Instruments, A Guide to
Board Layout for Best Thermal Resistance for Exposed Pad Packages
application report
- Texas Instruments, Semiconductor
and IC Package Thermal Metrics application note
- Texas Instruments, Thermal Design Made Simple with LM43603 and LM43602 application
report
- Texas Instruments, PowerPAD™
Thermally Enhanced Package application report
- Texas Instruments, PowerPAD™
Made Easy application report
- Texas Instruments, Using New
Thermal Metrics application report
- Texas Instruments, Layout
Guidelines for Switching Power Supplies application
report
- Texas Instruments, Simple Switcher
PCB Layout Guidelines application report
- Texas Instruments, Construction
Your Power Supply- Layout Considerations seminar
- Texas Instruments, Low Radiated
EMI Layout Made Simple with LM4360x and LM4600x application
report
- AN-2162 Simple Success With Conducted EMI From DC/DC Converters
user's guide