JAJSQG0C june   2015  – may 2023 ISO5851

PRODUCTION DATA  

1.   1
2. 1 特長
3. 2 アプリケーション
4. 3 概要
5. 4 Revision History
6. 5 概要 (続き)
7. 6 Pin Configuration and Function
8. 7 Specifications
   1. 7.1  Absolute Maximum Ratings
   2. 7.2  ESD Ratings
   3. 7.3  Recommended Operating Conditions
   4. 7.4  Thermal Information
   5. 7.5  Power Ratings
   6. 7.6  Insulation Characteristics
   7. 7.7  Safety-Related Certifications
   8. 7.8  Safety Limiting Values
   9. 7.9  Electrical Characteristics
   10. 7.10 Switching Characteristics
   11. 7.11 Insulation Characteristics Curves
   12. 7.12 Typical Characteristics
9. 8 Parameter Measurement Information
10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
       1. 9.3.1 Supply and Active Miller Clamp
       2. 9.3.2 Active Output Pulldown
       3. 9.3.3 Undervoltage Lockout (UVLO) With Ready (RDY) Pin Indication Output
       4. 9.3.4 Fault ( FLT) and Reset ( RST)
       5. 9.3.5 Short Circuit Clamp
    4. 9.4 Device Functional Modes
11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
       1. 10.2.1 Design Requirements
       2. 10.2.2 Detailed Design Procedure
          1. 10.2.2.1  Recommended ISO5851 Application Circuit
          2. 10.2.2.2  FLT and RDY Pin Circuitry
          3. 10.2.2.3  Driving the Control Inputs
          4. 10.2.2.4  Local Shutdown and Reset
          5. 10.2.2.5  Global-Shutdown and Reset
          6. 10.2.2.6  Auto-Reset
          7. 10.2.2.7  DESAT Pin Protection
          8. 10.2.2.8  DESAT Diode and DESAT Threshold
          9. 10.2.2.9  Determining the Maximum Available, Dynamic Output Power, POD-max
          10. 10.2.2.10 Example
          11. 10.2.2.11 Higher Output Current Using an External Current Buffer
       3. 10.2.3 Application Curves
12. 11Power Supply Recommendations
13. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
    3. 12.3 PCB Material
14. 13Device and Documentation Support
    1. 13.1 Device Support
       1. 13.1.1 サード・パーティ製品に関する免責事項
    2. 13.2 Documentation Support
       1. 13.2.1 Related Documentation
    3. 13.3 ドキュメントの更新通知を受け取る方法
    4. 13.4 サポート・リソース
    5. 13.5 Trademarks
    6. 13.6 静電気放電に関する注意事項
    7. 13.7 用語集
15. 14Mechanical, Packaging, and Orderable Information